Donald P Farrell

US Patent:

7465655, Dec 16, 2008

Filed:

Jul 27, 2006

Appl. No.:

11/494221

Inventors:

John M. Brennan - Wyomissing PA, US
Donald Farrell - Allentown PA, US
Joseph Michael Freund - Fogelsville PA, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

H01L 21/44
B23K 37/00

US Classification:

438617, 257E21506, 228 45

Abstract:

A method for performing a wire-bonding operation in an integrated circuit utilizes a bonding tool. A wire is bonded to a first bond site in the integrated circuit, and terminated at a second bond site in the integrated circuit. The bonding and terminating steps are repeated for a plurality of additional wire bonds of the integrated circuit. At least two wire bonds in the integrated circuit are substantially perpendicular to one another at a crossing point in a plan view of the integrated circuit.

US Patent:

20060043609, Mar 2, 2006

Filed:

Aug 26, 2004

Appl. No.:

10/926631

Inventors:

John Brennan - Wyomissing PA, US
Donald Farrell - Allentown PA, US
Joseph Freund - Fogelsville PA, US

International Classification:

H01L 23/52

US Classification:

257784000

Abstract:

An integrated circuit comprises an integrated circuit package and a plurality of circuit elements disposed within the integrated circuit package. A plurality of wire bonds provide connections for at least one of the circuit elements. At least one wire bond in a first subset of wire bonds and at least one wire bond in a second subset of wire bonds are substantially perpendicular to one another at a crossing point of the wire bonds in a plan view of the integrated circuit.