Douglas M Mathews

US Patent:

50458205, Sep 3, 1991

Filed:

Dec 10, 1990

Appl. No.:

7/624946

Inventors:

John L. Leicht - Hawthorn Woods IL
Hugh R. Malone - Phoenix AZ
Douglas J. Mathews - Mesa AZ
James E. Mitzlaff - Arlington Heights IL
Scott D. Munier - Arlington Heights IL
Michele G. Oehlerking - Riverside IL
Vernon R. Scott - Scottsdale AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01P 5107

US Classification:

333 26

Abstract:

A non-hermetic, three-dimensional, microwave semiconductor device carrier with integral waveguide couplers is disclosed. A molded plastic substrate having a suitable dielectric constant and varying thicknesses comprises plated conductors and locations for receiving GaAs MMIC's. MMIC's are mounted to a metal backplate and die bonded to the plated conductors. The waveguide couplers are integrally molded as part of the carrier substrate, and comprise plated through cylindrical members. Signals from a waveguide cavity are coupled to the MMIC's by inserting the waveguide couplers into a waveguide port. The carrier and integral waveguide coupler together with a plated molded cover forms a non-hermetic package providing pseudo-shielding cavities about the resident multiple semiconductor GaAs die. Transmission line impedance control is enhanced varying the substrate thickness on a per conductor basis. Frequency of operation exceeds 12 gigahertz.