Douglas J Peck

US Patent:

46856056, Aug 11, 1987

Filed:

Jun 9, 1986

Appl. No.:

6/872370

Inventors:

Donald J. Spigarelli - Carlisle MA
Douglas J. Peck - North Andover MA
James L. Finney - Hudson MA

Assignee:

The HTC Corporation - Concord MA

International Classification:

B23K 306

US Classification:

228 37

Abstract:

A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

US Patent:

47622644, Aug 9, 1988

Filed:

Sep 10, 1987

Appl. No.:

7/095485

Inventors:

Douglas J. Peck - North Andover MA

Assignee:

Dynapert-HTC Corporation - Farmington CT

International Classification:

B23K 304

US Classification:

228 37

Abstract:

A processing vessel has two adjacent tanks each holding different electronic liquids. When heated the first will generate saturated vapor having a temperature below the liquidus temperature of eutectic solder and the second, when heated, will generate saturated vapor having a temperature above the liquidus temperature of eutectic solder. Work product is sequentially passed through these vapors and is first preheated and then reflowed.

US Patent:

45413584, Sep 17, 1985

Filed:

Nov 28, 1983

Appl. No.:

6/555715

Inventors:

Donald J. Spigarelli - Carlisle MA
Douglas J. Peck - North Andover MA
Walter J. Hall - New Corner MA
James L. Finney - Hudson MA

Assignee:

The HTC Corporation - Concord MA

International Classification:

H05K 324

US Classification:

118 58

Abstract:

A solder leveling system for use in vapor phase soldering of printed wiring boards. A transport system operating in a near-horizontal mode moves the board to be solder coated through a vapor zone in a chamber having a solder pot which has a throat in line with the plane of the transport system. The near-horizontal movement through the vapor and into and out of the solder pot prevents solder sag and permits control of the thickness of solder deposited on the opposing board surfaces. Leveling nozzles are positioned in a vapor-filled chamber astride the transport system between the solder pot and the chamber throat. Perpendicular nozzle offset distance from the board and nozzle angle are adjustable. Preferably one nozzle projects a stream normal to the board, with the other nozzle projecting a grazing stream for clearing through holes. A nozzle flow rate corresponding to a predetermined energy threshold provides reliable hole clearing.

US Patent:

46977309, Oct 6, 1987

Filed:

Jun 9, 1986

Appl. No.:

6/872300

Inventors:

Donald J. Spigarelli - Carlisle MA
Douglas J. Peck - North Andover MA
James L. Finney - Hudson MA

Assignee:

The HTC Corporation - Concord MA

International Classification:

B23K 304
B23K 306

US Classification:

228 37

Abstract:

A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

US Patent:

48979341, Feb 6, 1990

Filed:

Aug 13, 1987

Appl. No.:

7/084963

Inventors:

Douglas J. Peck - North Andover MA

Assignee:

Emhart Industries, Inc. - Farmington CT

International Classification:

F26B 1900

US Classification:

34 78

Abstract:

The level of vapor generated by heaters located in boiling electronic liquid contained in a vessel is maintained at a first level below the path of travel of work product and is elevated to a second level above the work product to process the work product. After a selected processing time the vapor level is lowered to the lower level so that the work product will not be overheated.

US Patent:

47577800, Jul 19, 1988

Filed:

May 20, 1986

Appl. No.:

6/865232

Inventors:

Donald J. Spigarelli - Carlisle MA
Douglas J. Peck - North Andover MA
Walter J. Hall - New Corner MA
James L. Finney - Hudson MA

Assignee:

The HTC Corporation - Concord MA

International Classification:

H05K 324
B05C 310

US Classification:

118 64

Abstract:

A vapor phase system for soldering of a workpiece. A vessel for containing an electronic liquid which is heated to generate a zone of saturated vapor. A first inclined throat communicates with the vessel and a solder pot is located within the vessel. The solder pot including a reservoir for containing molten solder, a second throat aligned with the first throat and communicating at one end with molten solder contained in the reservoir means and communicating at the other end with the saturated vapor, molten solder contained in the reservoir means is pumped through the second throat and is captured by the reservoir and a conveyor carries work product through the first throat, through the saturated vapor and into the second throat whereby the work product will become immersed in the molten solder contained within the second throat.

US Patent:

45585245, Dec 17, 1985

Filed:

Oct 12, 1982

Appl. No.:

6/433662

Inventors:

Douglas J. Peck - North Andover MA
Donald J. Spigarelli - Carlisle MA

Assignee:

USM Corporation - Farmington CT

International Classification:

F26B 1900

US Classification:

34 78

Abstract:

A single vapor system for soldering, fusing, or brazing includes vertically disposed chambers which provide a draining and drying zone above a vapor processing zone. Draining occurs in the upper zone with no additional heat being added in vapor recovery. A sealing system is utilized which is actuated by the carrier elevator as an article-carrying basket is moved into and out of the zones. The sealing system includes a moveable top cover resting on the top of the article-carrying basket, with the top cover being left at the top of the draining and drying zone to seal the top of this zone when the basket is lowered to the bottom of this zone. A moveable bottom plate is raised by pulleys and weights, spring returns or other means to the bottom of the draining and drying zone such that the bottom plate seals the bottom of this zone, isolating the zones one from the other. Liquid drained from the article in the upper zone flows into a peripheral channel at the bottom plate to provide a liquid seal around the perimeter of the bottom plate. An unheated primary vapor recovery system and a combined system vent and unheated secondary recovery system are utilized for the draining and drying zone.