Dung H Le

Address:

9315 Bolsa Ave #42, Westminster, CA 92683

VIN:

5N1BR18A08C603165

Make:

NISSAN

Model:

PATHFINDER

Year:

2008

US Patent:

6536650, Mar 25, 2003

Filed:

Oct 11, 2001

Appl. No.:

09/973952

Inventors:

Paul Alan Dunham - Milton Keynes, GB
William Jordan Siegel - Bethesda MD
John Franklin Wood - New Windsor MD
Gary Silas Sines - Woodbine MD
Dung T. Le - Silver Spring MD
David L. Gilbert - Laurel MD
Jeffrey Alan Snell - Abingdon MD

Assignee:

Pace, Incorporated - Annapolis Junction MD

International Classification:

B23K 300

US Classification:

228 51, 228 55, 219229, 219238

Abstract:

A self-grounding soldering tip having a spring which serves for connecting the soldering tip to a heater bobbin for establishing a secure grounding of the soldering tip. A bobbin tube extends within the heater bobbin for removably retaining the soldering tip within the bobbin. The connection between the spring and bobbin tube provide tip-to-ground continuity. Moreover, the contact surfaces of the spring and bobbin tube are wiped clean upon plug-in and plug-out. The spring and bobbin tube are located in a cooler area of the soldering iron to slow down the rate of oxidation. Also, the spring and bobbin tube are made of the same or compatible materials, e. g. , stainless steel, to prevent reactions that normally occur between incompatible metals.

US Patent:

62378317, May 29, 2001

Filed:

Feb 22, 2000

Appl. No.:

9/510682

Inventors:

David W. Lawrence - Clarksville MD
Dung T. Le - Silver Spring MD
William Jordan Siegel - N. Bethesda MD
David Lee Gilbert - Collegeville PA

Assignee:

Pace, Incorporated - Laurel MD

International Classification:

B23K 100
B23K 300

US Classification:

228 205

Abstract:

A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and has an opening at its opposite end, and a hollow solder collection chamber part, having a tubular member with an open end and which is closed with respect to the passage of solder therethrough at an opposite end, forming a solder receiving space within it. The solder collection chamber part is concentrically positioned within the outer tube with an air plenum disposed between the closed end of the chamber part and the filter and with at least one air channel extending the length of solder collection part for providing a path for gases entering the open end of the outer tube to the plenum and the filter that is separated from the solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400. degree. F. , are not reactive with either solder and flux, which will burn with little or no residue at a temperature less than 800. degree. F.

US Patent:

61863874, Feb 13, 2001

Filed:

Apr 12, 1999

Appl. No.:

9/289720

Inventors:

David W. Lawrence - Clarksville MD
Dung T. Le - Silver Spring MD

Assignee:

Pace Incorporated - Laurel MD

International Classification:

B23K 100
B23K 300

US Classification:

228 205

Abstract:

A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and is open at its opposite end, and a hollow solder collection chamber part having a tubular member with an open end and a closed end forming a solder receiving space within it. The solder collection chamber part is concentrically positioned within the outer tube with an air plenum disposed between the closed end of the chamber part and the filter and with at least one air channel extending the length of solder collection part for providing a path for gases entering the open end of the outer tube to the plenum and the filter that is separated from said solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400. degree. F. , are not reactive with either solder and flux, which will bum with little or no residue at a temperature less than 800. degree. F.