Edward G Hall

US Patent:

55284612, Jun 18, 1996

Filed:

Nov 8, 1993

Appl. No.:

8/148245

Inventors:

Kiron Gore - Coral Springs FL
Edward J. Hall - Miami FL
John B. Brinkerhoff - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 702

US Classification:

361760

Abstract:

A printed circuit assembly (5) has a surface mount electronic component (14), circuit board (10), and locating features to align (16) the surface mount electronic component on the printed circuit board. The locating features may comprise solder bumps (24) on the printed circuit board. The locating features are arranged on the surface of the printed circuit board to lie proximal to the main body (22) of the surface mount electronic component. The locating features prevent movement of the surface mount electronic component prior to soldering the surface mount electronic component to the printed circuit board.

US Patent:

53698800, Dec 6, 1994

Filed:

May 6, 1993

Appl. No.:

8/057374

Inventors:

Ved V. Gundotra - Coral Springs FL
Lonnie L. Bernardoni - Boca Raton FL
Edward J. Hall - Hollywood FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 334

US Classification:

29840

Abstract:

An electronic circuit assembly (100) includes a circuit carrying substrate (150) on which electrical components (130) are mounted using solder deposits (125) having an essentially planar surface. A solder deposit (125) is created by forming a recess (155) in the substrate (150), providing a metallic pad (110) about the recess (155), depositing solder paste (120) on the metallic pad (110), and reflowing the solder paste (120) on the metallic pad (110). The electronic circuit (100) is assembled by placing electrical components (130) on the substrate (150) having solder deposits (125), and by further reflowing the solder deposits (125) on the metallic pad (110).

US Patent:

51080249, Apr 28, 1992

Filed:

Jun 3, 1991

Appl. No.:

7/709248

Inventors:

Vahid Kazem-Goudarzi - Sunrise FL
Edward J. Hall - Miami FL
Kiron P. Gore - Coral Springs FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 100

US Classification:

228104

Abstract:

A solder joint inspection system comprises a substrate (60) having at least one solder pad (56), a predetermined amount of solder (54) on the solder pad, and an image fluxing material (52) that fluoresces when an ultraviolet light source (42) is applied to the solder (54) and the fluxing material (52). When an ultraviolet light source is applied to the substrate having a predetermined amount of solder and fluxing material, a visual inspecting device (40) can verify if, in fact, the predetermined amount of solder and fluxing material is present.