Edward A Rutkowski

US Patent:

52005933, Apr 6, 1993

Filed:

Feb 4, 1991

Appl. No.:

7/650466

Inventors:

Edward D. Rutkowski - Detroit MI

International Classification:

B23K 2600

US Classification:

21912169

Abstract:

A method is disclosed for controlling the length of chips removed from a workpiece that is being machined. A path is etched into the surface of the workpiece by a laser beam and defines a pattern of chip break points. The material is cut away from the workpiece along a second path which periodically intersects with the first path. At the intersection point a chip will break away from the workpiece. By controlling the distance between intersection points, the present invention allows one to control the length of the chips formed during machining.

US Patent:

53844467, Jan 24, 1995

Filed:

Jan 25, 1993

Appl. No.:

8/008335

Inventors:

Edward D. Rutkowski - Detroit MI

International Classification:

B23K 2600

US Classification:

21912169

Abstract:

A method is disclosed for controlling the length of chips removed from a workpiece that is being machined. A path is etched into the surface of the workpiece by a laser beam and defines a pattern of chip break points. The material is cut away from the workpiece along a second path which periodically intersects with the first path. At the intersection point a chip will break away from the workpiece. By controlling the distance between intersection points, the present invention allows one to control the length of the chips formed during machining.