Elaine C Jacovich

US Patent:

52945219, Mar 15, 1994

Filed:

Jan 12, 1993

Appl. No.:

8/003206

Inventors:

Elaine C. Jacovich - Middlebury CT
Wells C. Cunningham - New Hartford CT

Assignee:

Hoechst Celanese Corporation - Somerville NJ

International Classification:

G03F 730
G03F 7023
C07C24512

US Classification:

430326

Abstract:

Positive photoresists formulations for producing positive photoresist images having improved thermal stability yet which allow a wide variation in resin to photoactive sensitizer compound without significant changes in photospeed, thermal behavior, contrast or resolution and with virtually no less in unexposed areas of the photoresist and without significant outgassing or popping are provided by employing novel 1,2-diazonaphthoquinone-4- or -5- sulfonate esters of 2,3,4,3',4',5'-hexahydroxybenzophenone with a novel isomeric distribution of esters. The novel isomeric distribution of 1,2-diazonaphthoquinone-4- or -5- sulfonate esters of 2,3,4,3',4',5'-hexahydroxybenzophenone is characterized by two major isomers, together comprising at least about 70% by weight of the photoactive compound, and wherein the least polar isomer comprises only about 40%.

US Patent:

52063488, Apr 27, 1993

Filed:

Jul 23, 1992

Appl. No.:

7/919357

Inventors:

Elaine C. Jacovich - Middlebury CT
Wells C. Cunningham - New Hartford CT

Assignee:

Morton International, Inc. - Chicago IL

International Classification:

C07C24512
C07C30971

US Classification:

534557

Abstract:

Positive photoresists formulations for producing positive photoresist images having improved thermal stability yet which allow a wide variation in resin to photoactive sensitizer compound without significant changes in photospeed, thermal behavior, contrast or resolution and with virtually no less in unexposed areas of the photoresist and without significant outgassing or popping are provided by employing novel 1,2-diazonaphthoquinone-4- or -5- sulfonate esters of 2,3,4,3',4',5'-hexahydroxybenzophenone with a novel isomeric distribution of esters. The novel isomeric distribution of 1,2-diazonaphthoquinone-4- or -5- sulfonate esters of 2,3,4,3',4',5'-hexahydroxybenzophenone is characterized by two major isomers, together comprising at least about 70% by weight of the photoactive compound, and wherein the least polar isomer comprises only about 40%.

US Patent:

39595234, May 25, 1976

Filed:

Dec 14, 1973

Appl. No.:

5/424896

Inventors:

John J. Grunwald - Waterbury CT
Peter E. Kukanskis - Naugatuck CT
Elaine F. Jacovich - Cheshire CT
Eugene D. D'Ottavio - Waterbury CT

Assignee:

MacDermid Incorporated - Waterbury CT

International Classification:

C23C 302
B05D 512

US Classification:

427 98

Abstract:

Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by an all-additive electroless deposition technique, in which the characterizing feature is the use of a two-stage metal deposition to build up the desired total thickness of metal. In the first stage a fine grained, thin deposit of metal is produced on the substrate which is then water rinsed and immersed in a second metal bath having a sufficiently high rate of deposition to produce the desired total thickness of metal in a commercially practical period of time. Improved adhesion of plated metal to the resin substrate, both before and after thermal shock, is achieved by resort to this two-stage plating procedure.

US Patent:

53957288, Mar 7, 1995

Filed:

Dec 15, 1993

Appl. No.:

8/168724

Inventors:

Elaine C. Jacovich - Middlebury CT
Wells C. Cunningham - New Hartford CT

International Classification:

G03F 7023
G03F 730

US Classification:

430192

Abstract:

Positive photoresists formulations for producing positive photoresist images having improved thermal stability yet which allow a wide variation in resin to photoactive sensitizer compound without significant changes in photospeed, thermal behavior, contrast or resolution and with virtually no less in unexposed areas of the photoresist and without significant outgassing or popping are provided by employing novel 1,2-diazonaphthoquinone-4- or -5- sulfonate esters of 2,3,4,3',4',5'-hexahydroxybenzophenone with a novel isomeric distribution of esters. The novel isomeric distribution of 1,2-diazonaphthoquinone-4- or -5- sulfonate esters of 2,3,4,3',4',5'-hexahydroxybenzophenone is characterized by two major isomers, together comprising at least about 70% by weight of the photoactive compound, and wherein the least polar isomer comprises only about 40%.

US Patent:

41003128, Jul 11, 1978

Filed:

Dec 2, 1976

Appl. No.:

5/747071

Inventors:

Michael S. Lombardo - Waterbury CT
Elaine F. Jacovich - Cheshire CT
Eugene D. D'Ottavio - Thomaston CT
John J. Grunwald - New Haven CT

Assignee:

MacDermid Incorporated - Waterbury CT

International Classification:

B05D 512
B32B 1508

US Classification:

427 96

Abstract:

An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil while providing at the interface prior to laminating of the foil to the plastic at least a mono molecular film of an organic silicon compound. After laminating the treated metal foil to the substrate under heat and pressure, the foil is chemically stripped from the substrate, leaving a surface of improved receptivity for conventional electroless plating and electroplating procedures, or other metallizing techniques. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment of the interface, especially in respect to adhesive strength at elevated temperature.

US Patent:

39782522, Aug 31, 1976

Filed:

Feb 24, 1975

Appl. No.:

5/552539

Inventors:

Michael S. Lombardo - Waterbury CT
Elaine F. Jacovich - Cheshire CT
Eugene D. D'Ottavio - Thomaston CT
John J. Grunwald - New Haven CT

Assignee:

MacDermid Incorporated - Waterbury CT

International Classification:

C23C 302
C23C 1302

US Classification:

427299

Abstract:

An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil by heat and pressure, chemically stripping the foil from the substrate surface, activating the surface for electroless plating and electrolessly depositing a metal thereon, wherein the substrate is contacted with an aqueous solution containing an organic silicon compound at some stage subsequent to said chemical stripping operation. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment.