Elizabeth A Burke

US Patent:

7956457, Jun 7, 2011

Filed:

Dec 2, 2008

Appl. No.:

12/326202

Inventors:

Raymond Albert Fillion - Niskayuna NY, US
Kevin M. Durocher - Waterford NY, US
Elizabeth A. Burke - Mechanicville NY, US
Thomas Bert Gorczyca - Schenectady NY, US
Charles G. Woychik - Niskayuna NY, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01L 23/34

US Classification:

257712, 257E23002, 257E2308, 438106, 438108

Abstract:

An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers.

US Patent:

20090291296, Nov 26, 2009

Filed:

May 21, 2008

Appl. No.:

12/154289

Inventors:

Paul Alan McConnelee - Schenectady NY, US
Arun Virupaksha Gowda - Rexford NY, US
Elizabeth Ann Burke - Mechanicville NY, US
Kevin Matthew Durocher - Waterford NY, US

Assignee:

GENERAL ELECTRIC COMPANY - Schenectady NY

International Classification:

B32B 15/00
B05D 5/12
B32B 38/04
B29C 65/02
B29C 65/52

US Classification:

428336, 427123, 156268, 156 60, 156150, 428457, 428332, 428335, 428334

Abstract:

A method of protecting sensitive components prior to, during or subsequent to advanced die packaging processing includes applying a metal stack layer such as titanium/copper (Ti/Cu) onto the front surface of a die assembly such that the die assembly front surface is covered with the metal stack layer. A layer of titanium/copper/titanium (Ti/Cu/Ti) or a solder alloy is also applied to the back surface of the die assembly such that the back surface of the die assembly is covered with the Ti/Cu/Ti layer or solder alloy. The front surface metal stack layer and the back surface Ti/Cu/Ti layer or solder alloy prevent degradation of die metallization prior to, during or subsequent to the advanced die packaging processing.

US Patent:

20130256900, Oct 3, 2013

Filed:

Mar 27, 2012

Appl. No.:

13/431168

Inventors:

Paul Alan McConnelee - Albany NY, US
Scott Smith - Niskayuna NY, US
Elizabeth Ann Burke - Mechanicville NY, US

International Classification:

H01L 23/48
H01L 21/768

US Classification:

257774, 438637, 257E21577, 257E23011

Abstract:

A method of forming a buried die module includes providing an initial laminate flex layer and forming a die opening through the initial laminate flex layer. A first uncut laminate flex layer is secured to the first surface of the initial laminate flex layer via an adhesive and a die is positioned within the die opening of the initial laminate flex layer. A second uncut laminate flex layer is secured to the second surface of the initial laminate flex layer via an adhesive and the adhesive between each pair of neighboring layers is cured. A plurality of vias and metal interconnects are formed in and on the first and second uncut laminate flex layers, with each of the metal interconnects extending through a respective via and being directly metalized to a metal interconnect on the initial laminate flex layer or a die pad on the die.

US Patent:

20140183750, Jul 3, 2014

Filed:

Feb 24, 2014

Appl. No.:

14/188093

Inventors:

- Schenectady NY, US
Scott Smith - Niskayuna NY, US
Elizabeth Ann Burke - Mechanicville NY, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01L 21/56
H01L 23/31

US Classification:

257773, 438118, 438107

Abstract:

A method of forming a buried die module includes providing an initial laminate flex layer and forming a die opening through the initial laminate flex layer. A first uncut laminate flex layer is secured to the first surface of the initial laminate flex layer by way of an adhesive material and a die is positioned within the die opening of the initial laminate flex layer and onto the adhesive material. A second uncut laminate flex layer is secured to the second surface of the initial laminate flex layer by way of an adhesive material and the adhesive materials are then cured. Vias and metal interconnects are formed in and on the first and second uncut laminate flex layers, with each of the metal interconnects extending through a respective via and being directly metalized to a metal interconnect on the initial laminate flex layer or a die pad on the die.