Geoffrey C. Herrick - Aloha OR Emmanuel Sang - Portland OR
Assignee:
Tektronix, Inc. - Beaverton OR
International Classification:
H01L 4108
US Classification:
310348
Abstract:
Apparatus is provided for mounting an electronic component having a pressure sensitive active area, which apparatus permits the component to expand and contract with changes in temperature and which does not introduce stresses into the active area of the component. The apparatus includes a cradle which, when attached to a substrate, forms a partial enclosure of the component but which leaves the active area unobscured. A packaging system is also provided wherein the bottom of the cavity of the lower portion of a standard integrated circuit package forms the substrate to be used in conjunction with the cradle for containing the electronic component.
Emmanuel Sang - Portland OR Gary L. Estabrook - Vancouver WA
Assignee:
Tektronix, Inc. - Beaverton OR
International Classification:
G01R 3102 G01R 106
US Classification:
324158P
Abstract:
A wafer probe head has a plate-form support member having a tip region and a mounting region. At least one electrically conductive probe tip is carried by the support member at the tip region. A connector is carried by the support member at a location spaced from the tip region, and the probe tip is electrically connected to the connector. The probe head also has a strain gauge for measuring physical distortion of the support member as a result of the probe tip being pressed against a device under test by virtue of relative movement between the mounting region of the support member and the device under test.
Philip B. Snow - Hillsboro OR Emmanuel Sang - Portland OR
Assignee:
Tektronix, Inc. - Beaverton OR
International Classification:
H03H 900
US Classification:
331117R
Abstract:
Suppression of radiated harmonics in a single stage transistor oscillator and transmitter circuit is achieved by inserting a narrow band filter, such as a surface acoustic wave resonator (SAWR), in the oscillator signal feedback loop at the point of emissions of the harmonics.
H. Erwin Grellmann - Beaverton OR Emmanuel Sang - Portland OR
Assignee:
Tektronix, Inc. - Beaverton OR
International Classification:
H01L 4108
US Classification:
310313R
Abstract:
A damped cradle for a pressure sensitive device is constructed in a unitary form. The cradle has a base that is attached to a substrate. Extending upward from the base are side arms with pairs of spring, or compliant, tips that contact the sides of the pressure sensitive device. Also extending upward from the base over the top of the pressure sensitive device are spring arms with compliant tips that contact the top surface of the pressure sensitive device in non-active areas. Vibrational forces in lateral (X-Y plane) directions are damped by friction between the bottom of the pressure sensitive device and the surface of the substrate, and vibration motion in the vertical, or Z, direction is stopped by enough spring force to overcome the maximum acceleration force the crystal mass encompasses for a given application. The spring forces of the spring tips and spring arms are balanced to produce a near zero pressure on the pressure sensitive device in both static and dynamic modes.