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Emre T Cuvalci

age ~37

from San Jose, CA

Also known as:
  • Cuvalci Emre
Phone and address:
3178 Manda Dr, San Jose, CA 95124

Emre Cuvalci Phones & Addresses

  • 3178 Manda Dr, San Jose, CA 95124
  • Sunnyvale, CA

Work

  • Company:
    Amazon lab126
    Nov 2019
  • Position:
    Product design engineer

Education

  • School / High School:
    San Jose State University
  • Specialities:
    Engineering

Skills

Mechanical Engineering • Design For Manufacturing • Semiconductors • Design of Experiments • Solidworks • Manufacturing • Product Design • Engineering Management • Matlab • Finite Element Analysis • R • Mechanical Product Design • Turkish • Line Management • Product Development • Engineering • Manufacturing Operations • Machining • Electronics • Cross Functional Team Leadership • English • Testing • Microsoft Office • International Work • Travel • Failure Analysis • Research and Development • Manufacturing Engineering • Conceptual Design • Interpersonal Communication • Mass Production • Manufacturing Processes • Assemblies • Technical Presentations • Cad Tools • Resolving Issues

Languages

Turkish

Industries

Mechanical Or Industrial Engineering

Resumes

Emre Cuvalci Photo 1

Product Design Engineer

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Location:
455 Brahms Way, Sunnyvale, CA 94087
Industry:
Mechanical Or Industrial Engineering
Work:
Amazon Lab126
Product Design Engineer

Applied Materials Aug 2013 - Apr 2016
Mechanical Design Engineer and Gate Stack and Oxidation and Rtp

Apple Aug 2013 - Apr 2016
Pd Engineer

Applied Materials Apr 2011 - Aug 2013
Mechanical Design Engineer and Epi

Shawn Seiki (S) Pte Ltd Feb 2011 - Apr 2011
Mechanical Design Engineer and Product Line Management
Education:
San Jose State University
Skills:
Mechanical Engineering
Design For Manufacturing
Semiconductors
Design of Experiments
Solidworks
Manufacturing
Product Design
Engineering Management
Matlab
Finite Element Analysis
R
Mechanical Product Design
Turkish
Line Management
Product Development
Engineering
Manufacturing Operations
Machining
Electronics
Cross Functional Team Leadership
English
Testing
Microsoft Office
International Work
Travel
Failure Analysis
Research and Development
Manufacturing Engineering
Conceptual Design
Interpersonal Communication
Mass Production
Manufacturing Processes
Assemblies
Technical Presentations
Cad Tools
Resolving Issues
Languages:
Turkish

Us Patents

  • Compact Ampoule Thermal Management System

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  • US Patent:
    20130319015, Dec 5, 2013
  • Filed:
    May 24, 2013
  • Appl. No.:
    13/902310
  • Inventors:
    ERROL ANTONIO C. SANCHEZ - Tracy CA, US
    KENRIC CHOI - San Jose CA, US
    MARCEL E. JOSEPHSON - San Jose CA, US
    DENNIS DEMARS - Santa Clara CA, US
    EMRE CUVALCI - San Jose CA, US
    MEHMET TUGRUL SAMIR - Mountain View CA, US
  • International Classification:
    F25B 21/02
  • US Classification:
    62 36
  • Abstract:
    Methods and apparatus for thermal management of a precursor for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of a precursor for use in substrate processing may include a body having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; a heat sink coupled to the one or more thermoelectric devices; and a fan disposed proximate to a back side of the heat sink to provide a flow of air to the heat sink.
  • Gas Injection Apparatus With Heating Channels

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  • US Patent:
    20210040612, Feb 11, 2021
  • Filed:
    Jun 22, 2020
  • Appl. No.:
    16/907870
  • Inventors:
    - Santa Clara CA, US
    Agus Sofian TJANDRA - Milpitas CA, US
    Emre CUVALCI - Sunnyvale CA, US
  • International Classification:
    C23C 16/455
    C23C 16/458
  • Abstract:
    A gas injection apparatus for a thermal processing chamber includes a gas injector having an inlet at a first end and a port at a second end; and a plate having a first opening matching the port, one or more second openings, and at least one circuitous flow path defined by the plate and fluidly connecting the first opening to the one or more second openings.
  • Finned Rotor Cover

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  • US Patent:
    20180269083, Sep 20, 2018
  • Filed:
    Mar 15, 2018
  • Appl. No.:
    15/921819
  • Inventors:
    - Santa Clara CA, US
    Chaitanya A. PRASAD - Bangalore, IN
    Emre CUVALCI - Sunnyvale CA, US
  • International Classification:
    H01L 21/67
    H01L 21/687
    H01L 21/324
  • Abstract:
    Embodiments described herein generally relate to a processing apparatus having a cover piece that participates in preheating a process gas. In one implementation, the cover piece includes an annulus. The annulus has an inner wall with a first height, an outer wall with a second height, and a top surface. The second height is greater than the first height. The cover piece also includes an inner lip disposed adjacent the inner wall, and a plurality of fins disposed on the top surface of the annulus. The cover piece and the plurality of fins are an opaque quartz material. The cover piece provides for more efficient heating of process gases, is composed of a material capable of withstanding process conditions while providing for more efficient and uniform processing, and has a low CTE reducing particle contamination due to excessive expansion during processing.
  • Rotor Cover

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  • US Patent:
    20180254206, Sep 6, 2018
  • Filed:
    Mar 6, 2018
  • Appl. No.:
    15/913496
  • Inventors:
    - Santa Clara CA, US
    Chaitanya A. Prasad - Bangalore, IN
    Emre Cuvalci - San Jose CA, US
  • International Classification:
    H01L 21/67
    F01L 9/04
    B04B 7/04
    H01L 21/02
  • Abstract:
    Implementations described herein generally relate to a processing apparatus having a rotor cover for preheating the process gas. The apparatus includes a chamber body having a side wall and a bottom wall defining an interior processing region. The chamber also includes a substrate support disposed in the interior processing region of the chamber body, a ring support, and a rotor cover. The rotor cover is disposed on a ring support. The rotor cover is an opaque quartz material. The rotor cover advantageously provides for more efficient heating of process gases, is composed of a material capable of withstanding process conditions while providing for more efficient and uniform processing, and has a low CTE reducing particle contamination due to excessive expansion during processing.
  • Gas Injection Apparatus With Heating Channels

    view source
  • US Patent:
    20180187305, Jul 5, 2018
  • Filed:
    Dec 29, 2017
  • Appl. No.:
    15/859035
  • Inventors:
    - Santa Clara CA, US
    Agus Sofian TJANDRA - San Jose CA, US
    Emre CUVALCI - San Jose CA, US
  • International Classification:
    C23C 16/455
  • Abstract:
    A gas injection apparatus for a thermal processing chamber includes a gas injector having an inlet at a first end and a port at a second end; and a plate having a first opening matching the port, one or more second openings, and at least one circuitous flow path defined by the plate and fluidly connecting the first opening to the one or more second openings.
  • H2/O2 Side Inject To Improve Process Uniformity For Low Temperature Oxidation Process

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  • US Patent:
    20160010206, Jan 14, 2016
  • Filed:
    Jul 8, 2015
  • Appl. No.:
    14/794355
  • Inventors:
    - Santa Clara CA, US
    Christopher S. OLSEN - Fremont CA, US
    Emre CUVALCI - San Jose CA, US
    Lara HAWRYLCHAK - Gilroy CA, US
  • International Classification:
    C23C 16/40
    C23C 16/455
    C23C 16/46
    C23C 16/52
  • Abstract:
    Embodiments disclosed herein generally include a method for forming an oxide layer having improved thickness uniformity on a substrate. The method includes heating a substrate disposed in a processing chamber to a temperature less than about 700 degrees Celsius, flowing a first gas mixture into the processing chamber from a first gas inlet, and flowing a second gas mixture into the processing chamber from a second gas inlet. The composition and flow rate of the second gas mixture, and the composition and flow rate of the first gas mixture are controlled so the oxide layer formed on the substrate has improved thickness uniformity.

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Emre Cuvalci


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