Eric F Hobbs

US Patent:

7368930, May 6, 2008

Filed:

Aug 15, 2006

Appl. No.:

11/464593

Inventors:

Eric D. Hobbs - Livermore CA, US
Christopher D. McCoy - Dublin CA, US
Alexander H. Slocum - Bow NH, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324758, 324754

Abstract:

A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.

US Patent:

7471078, Dec 30, 2008

Filed:

Dec 29, 2006

Appl. No.:

11/617929

Inventors:

Eric D. Hobbs - Livermore CA, US
Andrew W. McFarland - Dublin CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/28
G01R 31/02

US Classification:

3241581, 324754, 324758

Abstract:

A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.

US Patent:

7471094, Dec 30, 2008

Filed:

Jun 24, 2005

Appl. No.:

11/165833

Inventors:

Eric D. Hobbs - Livermore CA, US
Benjamin N. Eldridge - Danville CA, US
Lunyu Ma - San Jose CA, US
Gaetan L. Mathieu - Livermore CA, US
Steven T. Murphy - Rio Vista CA, US
Makarand S. Shinde - Livermore CA, US
Alexander H. Slocum - Bow NH, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754

Abstract:

A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

US Patent:

7592821, Sep 22, 2009

Filed:

Oct 23, 2007

Appl. No.:

11/877466

Inventors:

Benjamin N. Eldridge - Danville CA, US
Gary W. Grube - Pleasanton CA, US
Eric D. Hobbs - Livermore CA, US
Gaetan L. Mathieu - Vareness CA, US
Makarand S. Shinde - Livermore CA, US
Alexander H. Slocum - Bow NH, US
A. Nicholas Sporck - Saratoga CA, US
Thomas N. Watson - Pleasanton CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324760, 324761

Abstract:

A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

US Patent:

7622935, Nov 24, 2009

Filed:

Oct 20, 2006

Appl. No.:

11/551545

Inventors:

Eric D. Hobbs - Livermore CA, US
Alexander H. Slocum - Bow NH, US
Benjamin N. Eldridge - Danville CA, US
Keith J. Breinlinger - San Ramon CA, US
Shawn Powell - Pleasant Hill CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02
G01R 31/28

US Classification:

324754

Abstract:

A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

US Patent:

7658831, Feb 9, 2010

Filed:

Dec 21, 2005

Appl. No.:

11/306291

Inventors:

Gaetan L. Mathieu - Varennes CA, US
Treliant Fang - Dublin CA, US
Eric D. Hobbs - Livermore CA, US

Assignee:

FormFactor, Inc - Livermore CA

International Classification:

C25D 5/02

US Classification:

205136, 205118, 205183

Abstract:

Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

US Patent:

7671614, Mar 2, 2010

Filed:

Dec 2, 2005

Appl. No.:

11/164737

Inventors:

Benjamin N. Eldridge - Danville CA, US
Eric D. Hobbs - Livermore CA, US
Gaetan L. Mathieu - Livermore CA, US
Makarand S. Shinde - Livermore CA, US
Alexander H. Slocum - Bow NH, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324758

Abstract:

Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.

US Patent:

7688063, Mar 30, 2010

Filed:

Jun 30, 2008

Appl. No.:

12/165325

Inventors:

Andrew W. McFarland - Dublin CA, US
Kevin Youl Yasumura - San Ramon CA, US
Eric D. Hobbs - Livermore CA, US
Keith J. Breinlinger - San Ramon CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

3241581, 324754, 324760

Abstract:

A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.