Kurt D. Beigel - Boise ID Douglas J. Cutter - Boise ID Manny K. Ma - Boise ID Gordon D. Roberts - Meridian ID James E. Miller - Boise ID Daryl L. Habersetzer - Boise ID Jeffrey D. Bruce - Meridian ID Eric T. Stubbs - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G11C 700
US Classification:
365201, 365207
Abstract:
As part of a memory array, a circuit is provided for altering the drive applied to an access transistor that regulates electrical communication within the memory array. In one embodiment, the circuit is used to alter the drive applied to a sense amps voltage-pulling transistor, thereby allowing modification of the voltage-pulling rate for components of the sense amp. A sample of test data is written to the memory array and read several times at varying drive rates in order to determine the sense amps ability to accommodate external circuitry. In another embodiment, the circuit is used to alter the drive applied to a bleeder device that regulates communication between the digit lines of the memory array and its cell plate. Slowing said communication allows defects within the memory array to have a more pronounced effect and hence increases the chances of finding such defects during testing. The circuit is configured to accept and apply a plurality of voltages, either through a contact pad or from a series of discrete voltage sources coupled to the circuit.
Kurt D. Beigel - Boise ID Manny K. Ma - Boise ID Gordon D. Roberts - Meridian ID James E. Miller - Boise ID Daryl L. Habersetzer - Boise ID Jeffrey D. Bruce - Meridian ID Eric T. Stubbs - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G11C 2900
US Classification:
365201, 365203, 36518909
Abstract:
As part of a memory array, a circuit is provided for altering the drive applied to an access transistor that regulates electrical communication within the memory array. In one embodiment, the circuit is used to alter the drive applied to a sense amps voltage-pulling transistor, thereby allowing modification of the voltage-pulling rate for components of the sense amp. A sample of test data is written to the memory array and read several times at varying drive rates in order to determine the sense amps ability to accommodate external circuitry. In another embodiment, the circuit is used to alter the drive applied to a bleeder device that regulates communication between the digit lines of the memory array and its cell plate. Slowing said communication allows defects within the memory array to have a more pronounced effect and hence increases the chances of finding such defects during testing. The circuit is configured to accept and apply a plurality of voltages, either through a contact pad or from a series of discrete voltage sources coupled to the circuit.
Method And Apparatus For Reducing The Lock Time Of Dll
Eric T. Stubbs - Boise ID James E. Miller - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H03L 706
US Classification:
327156, 327159, 327161, 327263, 327276, 331 17
Abstract:
A delay locked loop having improved synchronization times has a variably adjustable delay line which accepts two incoming clock pulses. As each pulse propagates through the delay line an edge of the pulse toggles or retoggles a shift bit corresponding to a delay element. When the first pulse reaches the end of the delay line, the status of the shift bits is frozen, and a starting point for a synchronization sequence begins at the transition point between toggled and retoggled shift bits.
Kurt D. Beigel - Boise ID Manny K. Ma - Boise ID Gordon D. Roberts - Meridian ID James E. Miller - Boise ID Daryl L. Habersetzer - Boise ID Jeffrey D. Bruce - Meridian ID Eric T. Stubbs - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G11C 700
US Classification:
365201, 365205
Abstract:
As part of a memory array, a circuit is provided for altering the drive applied to an access transistor that regulates electrical communication within the memory array. In one embodiment, the circuit is used to alter the drive applied to a sense amps voltage-pulling transistor, thereby allowing modification of the voltage-pulling rate for components of the sense amp. A sample of test data is written to the memory array and read several times at varying drive rates in order to determine the sense amps ability to accommodate external circuitry. In another embodiment, the circuit is used to alter the drive applied to a bleeder device that regulates communication between the digit lines of the memory array and its cell plate. Slowing said communication allows defects within the memory array to have a more pronounced effect and hence increases the chances of finding such defects during testing. The circuit is configured to accept and apply a plurality of voltages, either through a contact pad or from a series of discrete voltage sources coupled to the circuit.
Kurt D. Beigel - Boise ID Douglas J. Cutter - Boise ID Manny K. Ma - Boise ID Gordon D. Roberts - Meridian ID James E. Miller - Boise ID Daryl L. Habersetzer - Boise ID Jeffrey D. Bruce - Meridian ID Eric T. Stubbs - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G11C 700
US Classification:
365201, 365203, 365205
Abstract:
As part of a memory array, a circuit is provided for altering the drive applied to an access transistor that regulates electrical communication within the memory array. In one embodiment, the circuit is used to alter the drive applied to a sense amps voltage-pulling transistor, thereby allowing modification of the voltage-pulling rate for components of the sense amp. A sample of test data is written to the memory array and read several times at varying drive rates in order to determine the sense amps ability to accommodate external circuitry. In another embodiment, the circuit is used to alter the drive applied to a bleeder device that regulates communication between the digit lines of the memory array and its cell plate. Slowing said communication allows defects within the memory array to have a more pronounced effect and hence increases the chances of finding such defects during testing. The circuit is configured to accept and apply a plurality of voltages, either through a contact pad or from a series of discrete voltage sources coupled to the circuit.
Kurt D. Beigel - Boise ID Douglas J. Cutter - Boise ID Manny K. Ma - Boise ID Gordon D. Roberts - Meridian ID James E. Miller - Boise ID Daryl L. Habersetzer - Boise ID Jeffrey D. Bruce - Meridian ID Eric T. Stubbs - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G11C 700
US Classification:
365201, 36518911
Abstract:
As part of a memory array, a circuit is provided for altering the drive applied to an access transistor that regulates electrical communication within the memory array. In one embodiment, the circuit is used to alter the drive applied to a sense amps voltage-pulling transistor, thereby allowing modification of the voltage-pulling rate for components of the sense amp. A sample of test data is written to the memory array and read several times at varying drive rates in order to determine the sense amps ability to accommodate external circuitry. In another embodiment, the circuit is used to alter the drive applied to a bleeder device that regulates communication between the digit lines of the memory array and its cell plate. Slowing said communication allows defects within the memory array to have a more pronounced effect and hence increases the chances of finding such defects during testing. The circuit is configured to accept and apply a plurality of voltages, either through a contact pad or from a series of discrete voltage sources coupled to the circuit.
Method Of Compensating For A Defect Within A Semiconductor Device
Kurt D. Beigel - Boise ID Manny K. Ma - Boise ID Gordon D. Roberts - Meridian ID James E. Miller - Boise ID Daryl L. Habersetzer - Boise ID Jeffrey D. Bruce - Meridian ID Eric T. Stubbs - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G11C 700
US Classification:
365201, 365203, 365205
Abstract:
As part of a memory array, a circuit is provided for altering the drive applied to an access transistor that regulates electrical communication within the memory array. In one embodiment, the circuit is used to alter the drive applied to a sense amps voltage-pulling transistor, thereby allowing modification of the voltage-pulling rate for components of the sense amp. A sample of test data is written to the memory array and read several times at varying drive rates in order to determine the sense amps ability to accommodate external circuitry. In another embodiment, the circuit is used to alter the drive applied to a bleeder device that regulates communication between the digit lines of the memory array and its cell plate. Slowing said communication allows defects within the memory array to have a more pronounced effect and hence increases the chances of finding such defects during testing. The circuit is configured to accept and apply a plurality of voltages, either through a contact pad or from a series of discrete voltage sources coupled to the circuit.
Method For Reducing Capacitive Coupling Between Conductive Lines
An embodiment of the present invention discloses a memory device having an array with digit lines arranged in complementary pairs, the array comprising; a substantially planar layer having trenches therein; a first level of digit lines residing at least partially in the trenches; a second level of digit lines residing on the surface of the layer, the second level extending in generally parallel relation to the digit lines in the first level. The first level of digit lines are in alternating positions with the second level of digit lines and the alternating positions comprise a repeating pattern of a first complementary pair of digit lines at the first level adjacent a second complementary pair of digit lines at the second level.
Isbn (Books And Publications)
Soviet Foreign Economic Policy and International Security
Micron Inc Jan 2018 - Dec 2018
Leadership Expat, Japan
Micron Technology Feb 1, 2006 - Dec 2018
Director, Dram Design and Development Quality
Education:
University of Idaho 1990 - 1993
Bachelors, Bachelor of Science, Electrical Engineering
Washington State University 1986 - 1988
Bachelors, Bachelor of Science, Physics
Skills:
Dram Product Engineering Semiconductors Cmos Ic Failure Analysis Jmp Semiconductor Industry Product Development Product Management Silicon Electronics Technical Recruiting Yield Debugging Characterization Design of Experiments Integrated Circuits Dynamic Random Access Memory Iso 9000 Ts16949 Technical Staff Management Mixed Signal Engineering Management Manufacturing Cross Functional Team Leadership Recruiting
Eric Stubbs. I miss you more and more everyday!i just wish i could talk to you one last time,hug you one last time,I love you,and miss you alot!Love,vLm!
Jonathan Sikardi, Angie Jones, Krista Davidson, Rebecca Boone, Mark Perry, Shelly Martin, Kathryn Nichols, Jennifer Langholf, Matthew Wells, Ashley Wheeler, James Carter
Eric Stubbs (1997-2001), Shannon Mckee (1975-1979), Kelly Patterson (1991-1993), Jimmy Gray (1981-1985), Dawn Ryan (1994-1998), Brad Stubbs (1989-1993)
C., Eric Stubbs, described Shens case as one of the biggest, if not the biggest murder investigation that IHIT has had in terms of the hours and effort put in by officers and the leading-edge investigative techniques used.The investigative path was extraordinary and I couldnt be more proud.