Eric R Tiongson

Address:

363 Cerro Ct, Daly City, CA 94015

VIN:

WDBUF56X87B181704

Make:

MERCEDES-BENZ

Model:

E-CLASS

Year:

2007

US Patent:

7733667, Jun 8, 2010

Filed:

Nov 16, 2006

Appl. No.:

11/560453

Inventors:

Youming Qin - Sunnyvale CA, US
Frank S. Matsumoto - San Ramon CA, US
Eric Tiongson - Daly City CA, US

Assignee:

Harris Stratex Networks Operating Corporation - Morrisville NC

International Classification:

H05K 7/14
H05K 9/00

US Classification:

361804, 361742, 361758, 361770, 361818, 361816, 174138 E, 174138 G, 174350

Abstract:

One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.

US Patent:

8644028, Feb 4, 2014

Filed:

Jun 7, 2010

Appl. No.:

12/795438

Inventors:

Youming Qin - Sunnyvale CA, US
Frank S. Matsumoto - San Ramon CA, US
Eric Tiongson - Daly City CA, US

Assignee:

Aviat U.S., Inc. - Santa Clara CA

International Classification:

H05K 5/00

US Classification:

361758, 361809, 361810

Abstract:

One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.

US Patent:

20040263291, Dec 30, 2004

Filed:

Jun 24, 2003

Appl. No.:

10/601753

Inventors:

Bruce Corkill - Eastbourne, NZ
Eric Tiongson - Daly City CA, US
Louis Salinas - Pleasanton CA, US

Assignee:

Stratex Networks, Inc.

International Classification:

H01P001/06

US Classification:

333/256000

Abstract:

A method of coupling together first and second waveguide connectors. The method including the steps of a) moving the connectors together to a first axial position in which part of the first connector engages a first axial stop on the second connector; b) causing relative movement between the first connector and the first axial stop; and c) moving the interface assemblies together axially after step b) to a second axial position in which part of the first connector engages a second axial stop on the second connector. Each waveguide connector includes a waveguide aperture; and one or more screw assemblies including a screw and captive nut. The waveguide connectors include a plug and socket connection with an elliptical profile. One of the connectors has a curved slot with two or more counterbores formed around the slot, and a securing member received in a first one of the counterbores. The polarization direction of the connector is changed by a) removing the securing member from the first one of the counterbores; b) rotating the waveguide interface until the securing member is aligned with a second end one of the counterbores; and c) inserting the securing member into the second one of the counterbores.

US Patent:

20080001686, Jan 3, 2008

Filed:

Jun 30, 2006

Appl. No.:

11/479893

Inventors:

Bruce Corkill - Lower Hutt, NZ
Eric Tiongson - Daly City CA, US
John Ruiz - San Jose CA, US

International Classification:

H01P 1/04

US Classification:

333254

Abstract:

Waveguide flanges for joining waveguide sections or components are designed to achieve mechanical strength and exhibit desired electrical properties such as relatively low insertion loss and high return loss. The present invention contemplates waveguide interfaces with a new choke flange designed to engage with a shield flange and provide a joint with improved electrical properties. The new choke designs produce a virtual continuity through the waveguide joints and minimize electrical energy leakage. The electrical and mechanical properties of the joint in the waveguide interfaces are robust and able to tolerate lower levels of parts precision, imperfect mating of the flanges without metal-to-metal contact and gaps up to 0.06″ or more between the mating flange surfaces.

US Patent:

20140198472, Jul 17, 2014

Filed:

Jan 17, 2014

Appl. No.:

14/158422

Inventors:

- Santa Clara CA, US
Frank S. Matsumoto - San Ramon CA, US
Eric Tiongson - Daly City CA, US

Assignee:

Aviat U.S., Inc. - Santa Clara CA

International Classification:

H05K 5/02
H05K 13/00

US Classification:

361807, 295921

Abstract:

One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.