Errol M Monsale

US Patent:

20130229201, Sep 5, 2013

Filed:

Mar 1, 2012

Appl. No.:

13/410040

Inventors:

Jitesh Shah - Fremont CA, US
Errol Monsale - Santa Clara CA, US

International Classification:

G01R 31/00

US Classification:

32475605

Abstract:

A test assembly () for testing a device () having a heat spreader (), a package substrate () having a substrate ground (G), and a grounding conductive segment (A), includes (i) an input conductive segment () that is electrically connected to the heat spreader (), (ii) a test board () having a board ground (), and (iii) a control system () that is electrically coupled to the input conductive segment () and the board ground (). During testing, the device () is positioned so that the substrate ground (G) is electrically connected to the board ground (). Additionally, the control system () directs a test current to one of the input conductive segment () and the board ground () to test the effectiveness of the grounding conductive segment (A) including a first electrical interface (A).