Eugene C Fischer

US Patent:

6442374, Aug 27, 2002

Filed:

Nov 4, 1998

Appl. No.:

09/185579

Inventors:

Vernon T. Brady - Orlando FL
Greg Stilwell - Orlando FL
Eugene Fischer - Clermont FL

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

H04B 140

US Classification:

455 73, 455 83, 455 86

Abstract:

The present invention is directed to providing a full duplex communication system capable of providing actual wireless transmission rates on the order of 125 Mb/s, or higher, with relatively high transmission power on the order of 0. 5 to 2 watts (W) or higher, with a high signal-to-noise(S/N) ratio, a bit error rate on the order of 10 or lower, 99. 99% availability, and with relatively simple circuit designs. Exemplary embodiments can provide these features using a single compact and efficient, low distortion transceiver design based on high power (e. g. , 0. 5 W) monolithic millimeter wave integrated circuits (MMICs), having a compression point which accommodates high speed modems such as OC-3 and 100 Mb/s Fast Ethernet modems used in broadband networking technologies like SONET/SDH (e. g. , SONET ring architectures having self-healing ring capability). By applying high power MMIC technology of conventional radar systems to wireless duplex communications, significant advantages can be realized.

US Patent:

6483404, Nov 19, 2002

Filed:

Aug 20, 2001

Appl. No.:

09/933269

Inventors:

Danny F. Ammar - Windermere FL
Eugene Fischer - Clermont FL

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01P 1203

US Classification:

333204, 333246

Abstract:

A millimeter wave filter for surface mount applications includes a dielectric base plate having opposing surfaces. A ground plane layer is formed on a surface of the dielectric base plate. At least one low temperature co-fired ceramic layer is positioned over the ground plane layer and defines an outer filter surface. A plurality of coupled line millimeter wavelength resonators are formed as stripline or microstrip and positioned on the outer filter surface. These resonators can be parallel coupled line filters, including hairpin resonators. Radio frequency terminal contacts are positioned on the surface of the dielectric base plate opposite the at least one low temperature co-fired ceramic layer. Conductive vias extend through the at least one low temperature co-fired ceramic layer, ground plane and dielectric base plate and interconnect the radio frequency terminal contacts and coupled line resonator.

US Patent:

6498551, Dec 24, 2002

Filed:

Aug 20, 2001

Appl. No.:

09/933128

Inventors:

Danny F. Ammar - Windermere FL
Eugene Fischer - Clermont FL
Gavin Clark - Tavares FL
John Hubert - Clermont FL
Glenn Larson - Winter Garden FL

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01P 100

US Classification:

333247, 333 33, 333 34, 333246, 333260, 257728

Abstract:

A low cost millimeter wave (MMW) module for a microwave monolithic integrated circuit (MMIC) includes a carrier board formed of a dielectric material and having at least one MMIC die mounted thereon and at least one interface line, such as a 50 Ohm microstrip interface line. A base plate is formed of a material that has a higher unmatched coefficient of thermal expansion (CTE) than the carrier board and supports same. A housing is mounted over the carrier board and engages the base plate. The housing has at least one subminiature coaxial connector (SMA) interface mounted thereon. A flexible circuit interconnect, such as a fuzz button, connects the subminiature coaxial connector and MMIC die through the interface line. A thermal interface member is positioned between the carrier board and base plate to aid in heat transfer between the base plate and housing and the lower CTE carrier board.

US Patent:

6594479, Jul 15, 2003

Filed:

Dec 28, 2000

Appl. No.:

09/749425

Inventors:

Danny F. Ammar - Windermere FL
Gavin James Clark - Tavares FL
Eugene Fischer - Clermont FL
John F. Hubert - Windermere FL

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

H04B 108

US Classification:

455347, 455 90, 361715, 361818

Abstract:

A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.

US Patent:

6608997, Aug 19, 2003

Filed:

Jan 11, 1999

Appl. No.:

09/227833

Inventors:

Eugene Fischer - Clermont FL
Steven K. Latham - Orlando FL

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

H04B 104

US Classification:

455127, 455115

Abstract:

The present invention is directed to an apparatus and method for varying the power level of a transmitted signal, such as a transmitted radio frequency signal, of high power, high transmission rate systems in a relatively straightforward, cost efficient manner. Exemplary embodiments can provide a range of stable DC control voltages for driving a power level attenuator, wherein the control voltages possess essentially no AC component (e. g. , in exemplary embodiments, at a 5 volt DC output, virtually no AC component in the millivolt range is present), and possess a high current capability (e. g. , at a 5 volt DC output exemplary embodiments can accommodate currents in excess of 0. 5 amps (A) up to 7 A or greater). The ability to provide very stable, high current capability transmission power attenuation is especially desirable for communication systems, and in particular, wireless communication systems wherein conservation of energy is important, and wherein transmission rates are on the order of 125 Mb/s or higher, and transmission power is on the order of 0. 5 to 2 watts (W) or higher.

US Patent:

6625881, Sep 30, 2003

Filed:

Aug 20, 2002

Appl. No.:

10/224622

Inventors:

Danny F. Ammar - Windermere FL
Gavin Clark - Tavares FL
Eugene Fischer - Clermont FL

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H05K 336

US Classification:

29830, 29832, 174 35 R, 174356 GC, 439 79, 439188

Abstract:

A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

US Patent:

6788171, Sep 7, 2004

Filed:

Mar 5, 2002

Appl. No.:

10/091382

Inventors:

Danny F. Ammar - Windermere FL
Eugene Fischer - Clermont FL
Gavin Clark - Tavares FL
John Hubert - Clermont FL
Glenn Larson - Winter Garden FL

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01P 100

US Classification:

333247, 333248, 333204, 333238

Abstract:

A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

US Patent:

6945786, Sep 20, 2005

Filed:

Aug 25, 2003

Appl. No.:

10/647681

Inventors:

Danny F. Ammar - Windermere FL, US
Gavin Clark - Tavares FL, US
Eugene Fischer - Clermont FL, US

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01R012/00

US Classification:

439 65, 439636

Abstract:

A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.