John A. Hughes - Falls Church VA, US Thomas E. Love - Gainesville VA, US Eugene Lemoine - Manassas VA, US David H. Lee - Arlington VA, US Christopher Ebel - Manassas VA, US
Assignee:
BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH
International Classification:
H01L 21/44 H01L 21/48 H01L 21/50
US Classification:
438106, 438109, 257E21499
Abstract:
A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
System And Method For Multi-Chip Module Die Extraction And Replacement
John A. Hughes - Falls Church VA, US Thomas E. Love - Gainesville VA, US Eugene Lemoine - Manassas VA, US Christopher Ebel - Manassas VA, US David H. Lee - Arlington VA, US
Assignee:
BAE SYSTEMS Information and Electronic Systems Integration Inc. - Nashua NH
International Classification:
H01L 23/48 H05K 1/11 H01L 21/50
US Classification:
257686, 174261, 438107, 257E2301, 257E21499
Abstract:
A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
Bae Systems 2005 - 2013
Senior Manufacturing Engineer
Micron Technology 2005 - 2005
Quality Control Engineer
Micron Technology 2002 - 2005
Senior Process Engineer
Dominion Semiconductor 1997 - 2002
Senior Process Engineer
Ibm 1994 - 1997
Process Engineer
Education:
Cornell University 1991 - 1995
Master of Science, Masters, Engineering
Stevens Institute of Technology 1987 - 1991
Bachelor of Engineering, Bachelors, Engineering
Nutley High School
Skills:
Six Sigma Engineering Management Defense Lean Manufacturing Manufacturing Engineering Systems Engineering Root Cause Analysis Customer Oriented Earned Value Management Connectivity Iv Green Belt Quality Engineer Iso 9000 Quality Assurance Enthusiast Engineering Design For Manufacturing Quality Auditing Iso 14001 Design of Experiments Manufacturing Failure Analysis Sql Positive Team Player Semiconductors Spc Kepner Tregoe Materials Science Yield Energetic Team Player