A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bunches of heat conducting strands extend into the first cooling portion so that each bunch is urged into deflecting contact with a respective chip. A fluid inlet and outlet are provided in the second cooling portion.
Method And Apparatus For Constructing An A/B Switch
A method for construction of an A/B switch is accomplished by press fitting two components of the switch together. The first component includes a circuit board with the switch circuitry. The circuit board is surrounded by an inner housing. An outer housing provides the output terminals for connecting the switch to other equipment. The outer housing has protrusions formed thereon for engaging and securing the inner housing when the inner and outer housings are press fit together.
Faquir C. Mittal - Audubon PA Frank J. Arrison - Warrington PA Arnold Schonfeld - Norristown PA
Assignee:
Sperry Corporation - New York NE
International Classification:
G11B 5012 G11B 2102
US Classification:
360 98
Abstract:
There is disclosed a closely arranged file of flexible rotating disk memory elements in which a disk may be randomly accessed with minimum error and relatively rapid access time. This disk system utilizes different diameter disks which are arranged in an ascending order in a sub-stack, are rotated at a relatively slow speed. A plurality of the sub-stacks, wherein there is a correspondence between the same diameter disk of each stack, are utilized to provide for a large memory capacity. Microprocessing techniques are utilized for sub-stack and disk selection.
Faquir C. Mittal - Audubon PA Charles R. Solis - Warminster PA
Assignee:
Sperry Corporation - New York NY
International Classification:
H05K 720
US Classification:
361387
Abstract:
An integrated circuit chip is cooled by being mounted on a substrate which is urged into contact with a compliant mat which includes a layer having a predetermined array of interconnected metallic pads for spreading heat flux more uniformly. The mat is connected to a plate which may be water cooled. The mat also includes additional layers which are heat conductive and electrically insulative. One of the additional layers is a film of paste.
There is disclosed a low-cost, axial fluid pump which does not involve the conversion of rotary to linear motion. The fluid pump herein is based on the principle of successively using a ball, that may be obtained from a reservoir of similar balls, as a piston within an enclosed cylinder. The ball is made to traverse the cylinder's length by simple non-motor means, thereby compressing the fluid. Upon pressurizing the fluid, the ball eventually returns to the reservoir and a new ball from the reservoir repeats the compression cycle. The pump of this invention is adapted for low pressure, low rate of flow, and low cost applications.
Faquir C. Mittal - Audubon PA Edwin R. Phillips - Rosemont PA
Assignee:
Sperry Corporation - New York NY
International Classification:
F28C 300 F01B 710
US Classification:
16510431
Abstract:
An oscillating coolant pump includes a pair of opposed bellows mounted to reciprocate in a housing for moving a volume of fluid through a heat exchanger and an electronics package. The pump functions without the use of check valves.