Feng M Gao

US Patent:

7351357, Apr 1, 2008

Filed:

Feb 26, 2003

Appl. No.:

10/374875

Inventors:

Feng Gao - Wilmington DE, US

Assignee:

E.I. du Pont de Nemours and Company - Wilmington DE

International Classification:

H01B 1/04
H01B 1/12
B05D 5/12

US Classification:

252500, 252510, 427 961, 427122

Abstract:

Additives to organic conducting polymers are described which enhance adhesion and resolution of printed films while retaining adequate electrical conductivity. The conductive polymer films are useful in printing conductive portions of thin film transistors such as sources and drains. Additives include surfactants, second macromolecules, plasticizers, and excess sulfonic acids.

US Patent:

7528448, May 5, 2009

Filed:

Jul 17, 2006

Appl. No.:

11/488200

Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Wilmington DE, US
Reid John Chesterfield - Santa Barbara CA, US
Howard David Glicksman - Durham NC, US
Marc B. Goldfinger - West Chester PA, US
Gary Delmar Jaycox - West Chester PA, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Irina Malajovich - Swarthmore PA, US
Hong Meng - Wilmington DE, US
Jeffrey Scott Meth - Landenberg PA, US
Geoffrey Nunes - Swarthmore PA, US
Gerard O'Neil - Newark DE, US
Kenneth George Sharp - Landenberg PA, US
Feng Gao - Hockessin DE, US

Assignee:

E.I. du Pont de Nemours and Company - Wilmington DE

International Classification:

H01L 27/01
H01L 27/12
H01L 31/0392

US Classification:

257352, 257347, 257E29151

Abstract:

The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

US Patent:

7582403, Sep 1, 2009

Filed:

Jul 17, 2006

Appl. No.:

11/488247

Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Greenville DE, US
Jonathan V. Caspar - Wilmington DE, US
John W. Catron - Smyrna DE, US
Reid John Chesterfield - Wilmington DE, US
Thomas C. Felder - Kennett Square PA, US
Feng Gao - Hockessin DE, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Dalen E. Keys - Landenberg PA, US
Irina Malajovich - Swarthmore PA, US
Jeffrey Scott Meth - Landenberg PA, US
Geoffrey Nunes - Swarthmore PA, US
Gerard O'Neil - Newark DE, US
Rinaldo S. Schiffino - Wilmington DE, US
Nancy G. Tassi - Gibbstown NJ, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

B41M 5/40
H01B 1/22
G03C 3/00
G03C 5/18

US Classification:

430200, 430 18, 252500

Abstract:

The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

US Patent:

7666567, Feb 23, 2010

Filed:

Oct 23, 2007

Appl. No.:

11/877633

Inventors:

Feng Gao - Hockessin DE, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Irina Malajovich - Swarthmore PA, US
Jeffrey Scott Meth - Landenberg PA, US
Kenneth George Sharp - Landenberg PA, US
Seema Agrawal - Newark DE, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

G03C 8/00

US Classification:

430200, 430201

Abstract:

Disclosed is a method negative imaging method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.

US Patent:

7666568, Feb 23, 2010

Filed:

Oct 23, 2007

Appl. No.:

11/877637

Inventors:

Feng Gao - Hockessin DE, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Dalen E. Keys - Landenberg PA, US
Irina Malajovich - Swarthmore PA, US
Rinaldo S. Schiffino - Wilmington DE, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

G03C 8/00

US Classification:

430200, 430201

Abstract:

Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.

US Patent:

7744717, Jun 29, 2010

Filed:

Apr 25, 2007

Appl. No.:

11/789842

Inventors:

Gerald Donald Andrews - Hockessin DE, US
Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Wilmington DE, US
John W. Catron - Smyrna DE, US
Feng Gao - Hockessin DE, US
Gary Delmar Jaycox - West Chester PA, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Jeffrey Scott Meth - Landenberg PA, US
Frank S. Principe - Landenberg PA, US
Rinaldo S. Schiffino - Wilmington DE, US
Robert Mar Yohannan - Rutledge PA, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

B29C 65/00
B32B 37/00
B32B 38/10
H01L 29/08
H01L 35/24
H01L 51/00

US Classification:

156247, 257 40

Abstract:

Provided are processes for enhancing the resolution of a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.

US Patent:

7901596, Mar 8, 2011

Filed:

Jun 19, 2009

Appl. No.:

12/487883

Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Wilmington DE, US
Jonathan V Caspar - Wilmington DE, US
John Catron, Jr. - Smyrna DE, US
Reid John Chesterfield - Santa Barbara CA, US
Thomas C. Felder - Kennett Square PA, US
Feng Gao - Hockessin DE, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Dalen E. Keys - Landenberg PA, US
Irina Malajovich - Swarthmore PA, US
Jeffrey Scott Meth - Landenberg PA, US
Geoffrey Nunes - Swarthmore PA, US
Gerard O'Neil - Newark DE, US
Rinaldo Soria Schiffino - Wilmington DE, US
Nancy G. Tassi - Gibbstown NJ, US

Assignee:

E.I. du Pont de Nemours and Company - Wilmington DE

International Classification:

H01B 1/02
H01B 1/22

US Classification:

252512, 252514

Abstract:

Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

US Patent:

8053840, Nov 8, 2011

Filed:

Mar 13, 2009

Appl. No.:

12/403685

Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Wilmington DE, US
Reid John Chesterfield - Santa Barbara CA, US
Marc B. Goldfinger - West Chester PA, US
Gary Delmar Jaycox - West Chester PA, US
Lynda Kaye Johnson - Wilmington DE, US
Irina Malajovich - Swarthmore PA, US
Hong Meng - Wilmington DE, US
Jeffrey Scott Meth - Landenberg PA, US
Kenneth George Sharp - Landenberg PA, US
Rinaldo Soria Schiffino - Wilmington DE, US
Feng Gao - Hockessin DE, US
Gerald Donald Andrews - Hockessin DE, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

H01L 27/01
H01L 27/12

US Classification:

257352, 257347, 257E29151

Abstract:

The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.