Feng Liu

US Patent:

6416685, Jul 9, 2002

Filed:

Apr 11, 2000

Appl. No.:

09/547187

Inventors:

Fan Zhang - Sunnyvale CA
Feng Liu - Sunnyvale CA
Dan Towery - Santa Clara CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

C09K 1300

US Classification:

252 791

Abstract:

The present invention relates to apparatus, procedures and compositions for avoiding and reducing damage to low dielectric constant materials and other soft materials, such as Cu and Al, used in fabricating semiconductor devices. Damage reduction can be achieved by decreasing the role of mechanical abrasion in the CMP of these materials and increasing the role of chemical polishing, which can also improve material removal rates. Increasing the role of chemical polishing can be accomplished by creating a polishing slurry, which contains components that interact chemically with the surface to be polished. This slurry may or may not also contain soft abrasive particles, which replace the hard abrasive particles of conventional slurries. Use of soft abrasive particles can reduce the role of mechanical abrasion in the CMP process. Use of this slurry in CMP can reduce surface scratches and device damage.

US Patent:

6423811, Jul 23, 2002

Filed:

Jul 19, 2000

Appl. No.:

09/619237

Inventors:

Kreisler S. Lau - Sunnyvale CA
Feng Quan Liu - Cupertino CA
Boris Korolev - San Jose CA
Emma Brouk - San Jose CA
Ruslan Zherebin - Daly City CA
David Nalewajek - West Seneca NY

Assignee:

Honeywell International Inc. - Norristown NJ

International Classification:

C08G 802

US Classification:

528125, 528127, 528170, 528205, 528220, 528397, 528401

Abstract:

A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.

US Patent:

6469123, Oct 22, 2002

Filed:

Jul 19, 2000

Appl. No.:

09/618945

Inventors:

Kreisler S. Lau - Sunnyvale CA
Feng Quan Liu - Cupertino CA
Boris A. Korolev - San Jose CA
Emma Brouk - San Jose CA
Ruslan Zherebin - Daly City CA
David Nalewajek - West Seneca NY

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

C08G 6378

US Classification:

528 86, 528205, 528207, 528208, 528211, 525132, 525149, 525152, 525168, 525177

Abstract:

In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

US Patent:

6493140, Dec 10, 2002

Filed:

Oct 14, 1999

Appl. No.:

09/418136

Inventors:

Wei-Zhong Li - San Jose CA
Yanfeng Yang - Sunnyvale CA
Feng Liu - Sunnyvale CA
Wei Luo - Chicago IL

Assignee:

Oplink Communications, Inc. - San Jose

International Classification:

G02B 2728

US Classification:

359495, 359494, 359497, 385 27, 385 33

Abstract:

A polarization splitter and combiner for processing a beam containing a first polarization and a second polarization to spatially separate these polarizations by using a birefringent element for receiving the beam and walking off the first polarization from the second polarization by an initial walk-off distance. A first lensing element with an optical axis is oriented to admit the first polarization at a first input point and output the first polarization at a first output angle to the optical axis and the second polarization at a second output angle to the optical axis. A second lensing element positioned after the first lensing element is oriented to receive the polarizations at input angles equal to their respective output angles, and outputs both polarizations at a first and second output point respectively. In a symmetrical arrangement, the first and second output points are separated by the initial walk-off distance. Additional walk-off control elements and optics can be interposed between the first and second lensing elements, depending on the functionality of the beam splitter and combiner or optical device employing the same.

US Patent:

6509415, Jan 21, 2003

Filed:

Apr 7, 2000

Appl. No.:

09/545058

Inventors:

Kreisler Lau - Sunnyvale CA
Feng Quan Liu - Cupertino CA
Boris Korolev - San Jose CA
Emma Brouk - Santa Clara CA
Rusian Zherebin - Daly City CA
Roger Leung - San Jose CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

C08F28100

US Classification:

525132, 525149, 525152, 525168, 525177, 525534, 525539

Abstract:

A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.

US Patent:

6713590, Mar 30, 2004

Filed:

Dec 3, 2001

Appl. No.:

10/004584

Inventors:

Kreisler S. Lau - Sunnyvale CA
Feng Quan Liu - Cupertino CA
Boris Korolev - San Jose CA
Emma Brouk - San Jose CA
Ruslan Zherebin - Daly City CA
David Nalewajek - West Seneca NY

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

C08G 802

US Classification:

528125, 528127, 528170, 528205, 528220, 528397, 528401

Abstract:

A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.

US Patent:

6736992, May 18, 2004

Filed:

May 14, 2002

Appl. No.:

10/145649

Inventors:

Fan Zhang - Mountain View CA
Feng Liu - Cupertino CA
Dan Towery - Santa Clara CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

C09K 1300

US Classification:

252 791

Abstract:

The present invention relates to apparatus, procedures and compositions for avoiding and reducing damage to low dielectric constant materials and other soft materials, such as Cu and Al, used in fabricating semiconductor devices. Damage reduction can be achieved by decreasing the role of mechanical abrasion in the CMP of these materials and increasing the role of chemical polishing, which can also improve material removal rates. Increasing the role of chemical polishing can be accomplished by creating a polishing slurry, which contains components that interact chemically with the surface to be polished. This slurry may or may not also contain soft abrasive particles, which replace the hard abrasive particles of conventional slurries. Use of soft abrasive particles can reduce the role of mechanical abrasion in the CMP process. Use of this slurry in CMP can reduce surface scratches and device damage.

US Patent:

6776693, Aug 17, 2004

Filed:

Jun 4, 2002

Appl. No.:

10/163796

Inventors:

Alain Duboust - Sunnyvale CA
Liang-Yuh Chen - Foster City CA
Yan Wang - Sunnyvale CA
Siew Neo - Santa Clara CA
Lizhong Sun - San Jose CA
Feng Q. Liu - Cupertino CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

B24B 100

US Classification:

451 41, 451 5, 451 36, 451 60, 451286, 451289, 451397, 451398, 204224 M, 205662

Abstract:

A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a basin and a polishing head. A carrier is disposed in the basin and has a substrate supporting surface. A retaining ring is disposed on the carrier and at least partially circumscribes the substrate supporting surface. The polishing head is supported above the basin and includes a conductive polishing pad. Embodiments may further include a vent to allow gas to escape through the polishing head. Embodiments may further include an electrolyte supply that flows electrolyte into the polishing head and out through a permeable electrode and the conductive pad to the substrate. Embodiments may also be configured with a polishing head diameter smaller than the substrate supported by the carrier.