Feng Su Yan

Feng Yan (Director)

Feng Yan

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Skills:

Formulation

Feng Yan

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Location:

United States

Feng Yan

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Location:

United States

Feng Yan Cambridge, MA

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Work:

Harvard University

May 2013 to 2000
Postdoctoral Fellow Northwestern University

Oct 2012 to 2000
Postdoctoral Fellow Drexel University
Philadelphia, PA
2011 to Sep 2012
Postdoctoral research associate University of Freiburg
Freiburg
May 2009 to Nov 2009
Visiting Scholar

Education:

National University of Singapore
Singapore
2007 to 2011
Ph. D in Materials Science & Engineering Zhejiang University
Hangzhou
2005 to 2007
M. S. in Materials Science & Engineering Xi'an University of Technology
Xi'an
2001 to 2005
B. E. in Materials Science & Engineering Northwestern University
Evanston, IL
2012
Postdoc in Materials Science and Engineering

Skills:

Thin films Deposition: Pulsed laser deposition (PLD); Magnetron Sputtering (DC/RF); Electrical transport and magnetic properties characterization: Ferroelectric tester, Dielectric analyzer, C-V, I-V, Vibrating Sample magnetometer (VSM), the superconducting quantum interface devices (SQUID), Electron paramagnetic resonance (EPR). Nanoscale Devices fabrication: Clean room, Photolithography, E-beam lithography, Etching, etc. Scanning Probe Microscopy: Atomic force microscopy (AFM), Piezoresponse force microscopy (PFM), Kelvin probe force microscopy (KPFM), Magnetic force microscopy (MFM), and Conductive-AFM (c-AFM) Thermal analysis: Thermal Gravimetrical Analysis (TGA), Differential Thermal Analysis (DTA), Differential Scanning Calorimeter (DSC) Spectroscopy and Spectrometry: UV-VIS, IR, Raman, Infrared Spectroscopy (IR), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS) Crystallographic Techniques: X-Ray Diffraction (XRD) Electron microscopy and relevant techniques: Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray Spectroscopy (EDS) Computational: Origin, Igor, Accelrys Materials Studio, AutoCAD and Microsoft Office.