Fethi Dhaoui - Patterson CA, US John McCollum - Saratoga CA, US Vidyadhara Bellippady - Cupertino CA, US Zhigang Wang - Sunnyvale CA, US
Assignee:
Actel Corporation - Mountain View CA
International Classification:
H01L 29/788
US Classification:
257316, 257317, 257321
Abstract:
A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor.
Non-Volatile Two-Transistor Programmable Logic Cell And Array Layout
Fethi Dhaoui - Patterson CA, US John McCollum - Saratoga CA, US Zhigang Wang - Sunnyvale CA, US
Assignee:
Actel Corporation - Mountain View CA
International Classification:
H01L 29/788
US Classification:
257316, 257317, 257321
Abstract:
A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor.
Non-Volatile Programmable Memory Cell And Array For Programmable Logic Array
Fethi Dhaoui - Patterson CA, US John McCollum - Saratoga CA, US Frank Hawley - Campbell CA, US Leslie Richard Wilkinson - Cave Junction OR, US
Assignee:
Actel Corporation - Mountain View CA
International Classification:
H01L 29/76
US Classification:
257369, 257314
Abstract:
A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.
Non-Volatile Memory Cells In A Field Programmable Gate Array
A non-volatile memory cell comprises a first floating gate transistor having a source, a drain, and a gate electrically coupled to a row line. A second floating gate transistor has a source, a drain, and a gate electrically coupled to the row line. A first p-channel MOS transistor has a source, a drain, and a gate, the drain of the first p-channel MOS transistor electrically coupled to the drain of the first floating gate transistor forming a first common node. A second p-channel MOS transistor has a source, a drain, and a gate, the first drain of the second p-channel MOS transistor electrically coupled to the drain of the second floating gate transistor forming a second common node, the gate of the second p-channel MOS transistor electrically coupled to the first common node, and the second common node electrically coupled to the gate of the first p-channel MOS transistor.
Non-Volatile Two-Transistor Programmable Logic Cell And Array Layout
Fethi Dhaoui - Patterson CA, US John McCollum - Saratoga CA, US Vidyadhara Bellippady - San Jose CA, US William C. Plants - Campbell CA, US Zhigang Wang - Sunnyvale CA, US
Assignee:
Actel Corporation - Mountain View CA
International Classification:
H01L 29/788
US Classification:
257316, 257317, 257321
Abstract:
A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor.
Non-Volatile Two-Transistor Programmable Logic Cell And Array Layout
Fethi Dhaoui - Patterson CA, US John McCollum - Saratoga CA, US Vidyadhara Bellippady - Cupertino CA, US Zhigang Wang - Sunnyvale CA, US
Assignee:
Actel Corporation - Mountain View CA
International Classification:
H01L 29/788
US Classification:
257316, 257317, 257321
Abstract:
A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor.
Non-Volatile Memory With Source-Side Column Select
Zhigang Wang - Sunnyvale CA, US Gregory Bakker - San Jose CA, US Volker Hecht - Barshinghausen, DE Santosh Yachareni - San Jose CA, US Fethi Dhaoui - Patterson CA, US Vidyadhara Bellippady - San Jose CA, US
Assignee:
Actel Corporation - Mountain View CA
International Classification:
G11C 16/04
US Classification:
36518511, 36518513, 36518517
Abstract:
A non-volatile memory array segment includes an odd-select transistor having a drain coupled to an odd-source line and an even-select transistor having a drain coupled to an even-source line. Two segment-select transistors have drains coupled to the sources of different ones of the odd and even source lines, sources coupled to ground, and gates coupled to a segment-select line. A plurality of odd non-volatile memory transistors each has a drain coupled to a common drain line, a source coupled to the odd-source line, a floating gate, and a control gate. A plurality of even non-volatile memory transistors, each has a drain coupled to the common drain line, a source coupled to the even-source line, a floating gate, and a control gate. The control gate of each even non-volatile memory transistor is coupled to the control gate of a different one of the odd non-volatile memory transistors.
Non-Volatile Two-Transistor Programmable Logic Cell And Array Layout
Fethi Dhaoui - Patterson CA, US John McCollum - Saratoga CA, US Vidyadhara Bellippady - Cupertino CA, US William C. Plants - Campbell CA, US Zhigang Wang - Sunnyvale CA, US
Assignee:
Actel Corporation - Mountain View CA
International Classification:
H01L 29/788
US Classification:
257316, 257317, 257321
Abstract:
A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor.