Forrest L Voss

US Patent:

48307041, May 16, 1989

Filed:

Jan 29, 1988

Appl. No.:

7/149797

Inventors:

Forrest L. Voss - Cedar Rapids IA
Donald R. Witherell - Cedar Rapids IA

Assignee:

Rockwell International Corporation - El Segundo CA

International Classification:

B44C 122
C23F 102
C03C 1500
B29C 3700

US Classification:

156629

Abstract:

A multi-layered printing wiring board and a method for manufacture where the multi-layered printing wiring board has thermal expansion controlling copper invar copper core therein with portions of the invar core therein with portions of the invar being selectively removed and replaced with superior materials for plating conductive material there to and further having a reduced coefficient of thermal conductivity by providing for a noble metal layer to be selectively deposited on pre-determined positions on the copper invar copper core thereby selectively etching portions of the copper and invar up to the noble metal layer and thereby providing for selectively removing the invar and replacing it with a laminant material.

US Patent:

49210548, May 1, 1990

Filed:

Oct 21, 1988

Appl. No.:

7/278295

Inventors:

Forrest L. Voss - Cedar Rapids IA
Donald R. Witherell - Cedar Rapids IA

Assignee:

Rockwell International Corporation - El Segundo CA

International Classification:

H05K 100

US Classification:

174255

Abstract:

A multi-layered printing wiring board and a method for manufacture where the multi-layered printing wiring board has a thermal expansion controller Copper-Invar-Copper core therein with portions of the invar core therein with portions of the Invar being selectively removed and replaced with superior materials for plating conductive material there to and further having a reduced coefficient of thermal conductivity by providing for a noble metal layer to be selectively deposited on pre-determined positions on the Copper-Invar-Copper core thereby selectively etching portions of the copper and Invar up to the noble metal layer and thereby providing for selectively removing the Invar and replacing it with a laminant material.