Francis M Morris

US Patent:

7098442, Aug 29, 2006

Filed:

Mar 5, 2003

Appl. No.:

10/382745

Inventors:

Premjeet Chahal - Plano TX, US
Francis J. Morris - Dallas TX, US

Assignee:

Raytheon Company - Wsltham MA

International Classification:

G02F 1/01

US Classification:

250225, 359486

Abstract:

A polarizing filter includes a portion with a filtering layer having a plurality of openings extending therethrough, where this portion has a maximum physical thickness in a radiation travel direction which is less than approximately one wavelength of the radiation being filtered. A method of making the filter includes: forming a filtering layer over a substrate; creating a plurality of openings through a portion of the filtering layer; and separating the filtering layer from the substrate.

US Patent:

7405869, Jul 29, 2008

Filed:

May 2, 2007

Appl. No.:

11/743489

Inventors:

Francis J. Morris - Dallas TX, US
Premjeet Chahal - Gurnee IL, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

G02F 1/35
G01S 13/00

US Classification:

359330, 359332, 342 99, 342100

Abstract:

Methods and apparatus for local oscillator generation are provided. In a method embodiment, a method of signal processing includes splitting a signal having a first frequency into at least a first portion and a second portion. The method also includes generating a second signal having a second frequency at a predetermined frequency difference from the first frequency by optically modulating the first portion. In addition, the method includes generating a third signal having a frequency component at a frequency that is approximately the same as the predetermined frequency difference from the first frequency by combining the second portion with the second signal.

US Patent:

7474171, Jan 6, 2009

Filed:

Jun 1, 2005

Appl. No.:

11/143410

Inventors:

Francis J. Morris - Dallas TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01P 1/10

US Classification:

333101, 257600

Abstract:

A Micro-Electro-Mechanical system (MEMS) device includes a doped semiconductor layer that is disposed outwardly from a substrate. The MEMS device further includes an insulation layer that is disposed outwardly from and in contact with the doped semiconductor layer. The MEMS device also includes a conductive membrane that is disposed outwardly from the insulation layer by a distance that defines an air gap between the conductive membrane and the insulation layer. The conductive membrane is operable to come in contact with the insulation layer when an appropriate voltage is applied between the conductive membrane and the doped semiconductor layer. In one particular embodiment, the combination of the doped semiconductor layer and the insulation layer operates to provide a path to dissipate any excess electrical charge received by the insulation layer.

US Patent:

7859658, Dec 28, 2010

Filed:

Aug 28, 2006

Appl. No.:

11/467731

Inventors:

Premjeet Chahal - Plano TX, US
Francis J. Morris - Dallas TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

G02B 5/20

US Classification:

356256, 250225, 359885

Abstract:

A polarizing filter includes a portion with a filtering layer having a plurality of openings extending therethrough, where this portion has a maximum physical thickness in a radiation travel direction which is less than approximately one wavelength of the radiation being filtered. A method of making the filter includes: forming a filtering layer over a substrate; creating a plurality of openings through a portion of the filtering layer; and separating the filtering layer from the substrate.

US Patent:

8114576, Feb 14, 2012

Filed:

Feb 29, 2008

Appl. No.:

12/040406

Inventors:

Francis J. Morris - Dallas TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

G03F 7/26

US Classification:

430311, 430330

Abstract:

In accordance with the teachings of one embodiment of the present disclosure, a method of forming high-density metal interconnects on flexible, thin-film plastic includes laminating a dry photoresist layer to a substrate. The photoresist-laminated substrate is baked. An assembly is formed by laminating a plastic film to the baked, photoresist-laminated substrate. One or more electrically conductive interconnect layers are processed on a first surface of the laminated plastic film. The processing of the one or more electrically conductive interconnects includes photolithography. The assembly is baked and soaked in a liquid. The processed plastic film is then separated from the substrate.

US Patent:

8368491, Feb 5, 2013

Filed:

Apr 22, 2010

Appl. No.:

12/765512

Inventors:

Brandon W. Pillans - Plano TX, US
Francis J. Morris - Dallas TX, US
Mikel J. White - Murphy TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01H 51/22

US Classification:

335 78, 200181

Abstract:

Systems and methods for providing high-capacitive RF MEMS switches are provided. In one embodiment, the invention relates to a micro-electro-mechanical switch assembly including a substrate, an electrode disposed on a portion of the substrate, a dielectric layer disposed on at least a portion of the electrode, a metal layer disposed on at least a portion of the dielectric layer, and a flexible membrane having first and second ends supported at spaced locations on the substrate base, where the flexible membrane is configured to move from a default position to an actuated position in response to a preselected switching voltage applied between the flexible membrane and the electrode, and where, in the actuated position, the flexible membrane is in electrical contact with the metal layer.

US Patent:

8535797, Sep 17, 2013

Filed:

Jan 13, 2012

Appl. No.:

13/349772

Inventors:

Francis J. Morris - Dallas TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

B32B 15/08

US Classification:

428345, 428344, 428352, 428209, 174250, 174255

Abstract:

In accordance with the teachings of one embodiment of the present disclosure, a method of forming high-density metal interconnects on flexible, thin-film plastic includes laminating a dry photoresist layer to a substrate. The photoresist-laminated substrate is baked. An assembly is formed by laminating a plastic film to the baked, photoresist-laminated substrate. One or more electrically conductive interconnect layers are processed on a first surface of the laminated plastic film. The processing of the one or more electrically conductive interconnects includes photolithography. The assembly is baked and soaked in a liquid. The processed plastic film is then separated from the substrate.

US Patent:

8629360, Jan 14, 2014

Filed:

Apr 30, 2012

Appl. No.:

13/460056

Inventors:

Brandon William Pillans - Plano TX, US
Cody Blake Moody - Frisco TX, US
Francis Joseph Morris - Dallas TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01H 57/00

US Classification:

200181

Abstract:

An RF MEMS capacitive switch aligns holes in one of its electrodes to dielectric posts to reduce trapped charge without affecting the capacitance ratio of the switch. When actuated, the electrode contacts the posts' one or more contact surfaces around the plurality of holes so that each hole overlaps at least a central portion of the post to which it is aligned. By selecting the hole size such that the top electrode appears to be approximately a continuous conductive sheet at the RF frequency, the alignment of the holes to the posts reduces the amount of trapped charge without lowering switch capacitance. In different embodiments, the post diameter may be smaller than the hole diameter so that the overlap is complete, in which case trapped charge is largely eliminated.