Fred W Verdi

US Patent:

RE37637, Apr 9, 2002

Filed:

Nov 3, 1999

Appl. No.:

09/433094

Inventors:

Mark Bradford Clifton - West Windsor NJ
Richard Michael Flynn - Noblesville IN
Fred William Verdi - Lawrenceville NJ

Assignee:

Lucent Technologies Inc. - Murray Hill DE

International Classification:

H01C 2302

US Classification:

257679, 257669, 257728, 257782

Abstract:

Thin semiconductor die, approximately 0. 004 to 0. 007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

US Patent:

54175771, May 23, 1995

Filed:

Jul 26, 1993

Appl. No.:

8/096880

Inventors:

Albert Holliday - Langhorne PA
Maureen B. Schmidt - Fairless Hills PA
Fred W. Verdi - Lawrenceville NJ

Assignee:

AT&T Corp. - Murray Hill NJ

International Classification:

H01R 458

US Classification:

439 91

Abstract:

An improved electrical connection between each of a set of metallized areas (16) on a first substrate (11 ) and those on a second substrate (12), via a layer of anisotropically conductive material (22) sandwiched therebetween, is obtained by arraying the metallized areas in concentric rings about each of a plurality of fasteners (28) extending through both substrates and the material. By arraying the metallized areas in concentric rings about each fastener, the anisotropically conductive material in contact with the metallized areas arrayed in each ring will advantageously be subjected to a uniform pressure by the fastener, improving the conductivity of the material.

US Patent:

52725960, Dec 21, 1993

Filed:

Jun 24, 1991

Appl. No.:

7/720130

Inventors:

Jack P. Honore - Trenton NJ
Fred W. Verdi - Lawrenceville NJ

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

H05K 111

US Classification:

361633

Abstract:

A personal data card (10) is fabricated from a polymer thick-film circuit (12) formed of a polymer sheet (14) having a plurality of pads (16 and 17) and interconnecting paths (18) printed thereon with a copper-filled polymer ink. Each of a selected set of the pads (16) has a layer of nickel (22) applied to it, and then a layer of gold (24) applied above the nickel, to facilitate wire bonding of each of a plurality of aluminum leads (21), associated with a semiconductor die (19), to a corresponding pad. Use of such a polymer thick-film circuit (12) in the fabrication of the data card (10) reduces the cost of the card.

US Patent:

54808421, Jan 2, 1996

Filed:

Apr 11, 1994

Appl. No.:

8/225687

Inventors:

Mark B. Clifton - Robbinsville NJ
Richard M. Flynn - Noblesville IN
Fred W. Verdi - Lawrenceville NJ

Assignee:

AT&T Corp. - Murray Hill NJ

International Classification:

H01L 21304

US Classification:

437226

Abstract:

Improved methods for fabricating smart cards are disclosed. Semiconductor die approximately 0. 004 to 0. 007 inches thick are fabricated using chemical stress relief processes and UV dicing tape. The die are positioned substantially on the neutral axis of a smart card, thereby providing smart cards having improved resistance to mechanical flexure.

US Patent:

57194378, Feb 17, 1998

Filed:

Apr 19, 1996

Appl. No.:

8/635072

Inventors:

Mark Bradford Clifton - Robbinsville NJ
Richard Michael Flynn - Noblesville IN
Fred William Verdi - Lawrenceville NJ

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H01C 2302
H01C 23495
H01C 2334

US Classification:

257679

Abstract:

Thin semiconductor die, approximately 0. 004 to 0. 007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

US Patent:

62393596, May 29, 2001

Filed:

May 11, 1999

Appl. No.:

9/309943

Inventors:

Peter Frederick Lilienthal - Princeton NJ
Fred William Verdi - Lawrenceville NJ

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

H05K 900

US Classification:

174 35GC

Abstract:

An EMI shield for use on a printed wiring board (PWB) of a circuit pack includes an open-ended box-like structure having a laterally extending flange completely encircling the opening into the box-like structure. The box is of an EMI impervious material, preferably stainless steel. An electrically conductive O-ring gasket is disposed in a groove in the flange. Both the groove and the flange completely encircle the box opening. The shield is secured to a PWB by pegs secured to the flange at positions radially outwardly of the gasket and extending entirely through openings through the PWB. Preferred pegs comprises pairs of side-by-side prongs integral with the shield flange but extending downwardly therefrom. Each prong terminates in an oppositely directed, return-bent detent with the detent pairs functioning as a spring-biased latch for removably mounting the shield to the PWB.

US Patent:

49211609, May 1, 1990

Filed:

Feb 29, 1988

Appl. No.:

7/161515

Inventors:

Richard M. Flynn - Indianapolis IN
Fred W. Verdi - Lawrenceville NJ

Assignee:

American Telephone and Telegraph Company - New York NY

International Classification:

G06K 1906

US Classification:

235492

Abstract:

A personal data card (10), comprised of a semiconductor chip (28), sealed by encapsulant (38) in an opening (26) in a body (12), is advantageously provided with a shock absorbing device (38) which substantially circumscribes the encapsulant to substantially isolate the encapsulant from the body of the card. By isolating the encapsulant from the card body, the shock absorbing device reduces the stresses transmitted from the card body into the capsulant and into the chip when the card is flexed. In this way the incidence of cracking of the chip caused by the stresses generated upon flexing of the card is reduced.

US Patent:

51902850, Mar 2, 1993

Filed:

Sep 30, 1991

Appl. No.:

7/767585

Inventors:

Robert B. Levy - Morrisville PA
Fred W. Verdi - Lawrenceville NJ

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

A63F 924

US Classification:

273 85G

Abstract:

An electronic game (10) is provided with at least one, and preferably a plurality, of intelligent game pieces (14,14' ) which each contain a re-programamble memory device (30,70). The memory device (30,70) in each of the game pieces (14 and 14', respectively), stores characteristics of an activity to be simulated by the game (10). By re-programming the game pieces (14,14'), the characteristics of the activity simulated by the game (10) can be changed to make the activity more interesting and challenging.