Gary A Lewis

US Patent:

D635559, Apr 5, 2011

Filed:

Sep 15, 2010

Appl. No.:

29/369966

Inventors:

Ryan P Rye - Duluth GA, US
Gary A Lewis - Norcross GA, US

Assignee:

Motorola Mobility, Inc. - Libertyville IL

International Classification:

1401

US Classification:

D14223

US Patent:

57563802, May 26, 1998

Filed:

Nov 2, 1995

Appl. No.:

8/556782

Inventors:

Howard M. Berg - Scottsdale AZ
Sankaranarayanan Ganesan - Chandler AZ
Gary L. Lewis - Peoria AZ
George W. Hawkins - Gilbert AZ
James W. Sloan - Austin TX
Scott C. Bolton - Austin TX

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2160

US Classification:

438126

Abstract:

A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122). In practicing these operations, the following interfaces are targeted and their adhesion characteristics are improved: die attach material to die pad; die attach material to die; molding compound to die pad; and molding compound to die attach material.

US Patent:

43994539, Aug 16, 1983

Filed:

Mar 23, 1981

Appl. No.:

6/246506

Inventors:

Howard M. Berg - Scottsdale AZ
Gary L. Lewis - Peoria AZ
Curtis W. Mitchell - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2302
H01L 2714
H01L 3300

US Classification:

357 81

Abstract:

A package for fiber optic semiconductor devices is disclosed in which heat is conducted by both a heat spreader and through a plastic enclosure portion of the package.

US Patent:

43291902, May 11, 1982

Filed:

Jun 6, 1979

Appl. No.:

6/045903

Inventors:

Howard M. Berg - Scottsdale AZ
Gary L. Lewis - Peoria AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G02B 726
H01L 3112

US Classification:

156 60

Abstract:

A process is described for attaching optical fiber to a semiconductor die in which a first droplet of adhesive is applied to the die and partially gelled to form a cushion for receiving the end of the optical fiber to be attached thereto.