Gary P O'Brien

US Patent:

8426289, Apr 23, 2013

Filed:

Sep 14, 2011

Appl. No.:

13/232209

Inventors:

Andrew B. Graham - Redwood City CA, US
Gary Yama - Mountain View CA, US
Gary O'Brien - Palo Alto CA, US

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/76

US Classification:

438404, 438421, 438424, 438427, 257E21546

Abstract:

In one embodiment, a method of forming an insulating spacer includes providing a base layer, providing an intermediate layer above an upper surface of the base layer, etching a first trench in the intermediate layer, depositing a first insulating material portion within the first trench, depositing a second insulating material portion above an upper surface of the intermediate layer, forming an upper layer above an upper surface of the second insulating material portion, etching a second trench in the upper layer, and depositing a third insulating material portion within the second trench and on the upper surface of the second insulating material portion.

US Patent:

8580691, Nov 12, 2013

Filed:

Sep 14, 2011

Appl. No.:

13/232012

Inventors:

Andrew B. Graham - Redwood City CA, US
Gary Yama - Mountain View CA, US
Gary O'Brien - Palo Alto CA, US

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/302
H01L 21/461

US Classification:

438692, 438693, 216 89

Abstract:

A method of shaping a substrate in one embodiment includes providing a first support layer, providing a first shaping pattern on the first support layer, providing a substrate on the first shaping pattern, performing a first chemical mechanical polishing (CMP) process on the substrate positioned on the first shaping pattern, and removing the once polished substrate from the first shaping pattern.

US Patent:

20120038372, Feb 16, 2012

Filed:

Aug 11, 2011

Appl. No.:

13/207822

Inventors:

Jochen Reinmuth - Reutlingen, DE
Gary O'Brien - Palo Alto CA, US

International Classification:

G01R 27/26
H02K 15/00
H02N 1/00

US Classification:

324661, 310300, 29596

Abstract:

A micromechanical component is described having a substrate which has a movable mass which is connected via at least one spring to the substrate so that the movable mass is displaceable with respect to the substrate, and at least one fixedly mounted stator electrode. The movable mass and the at least one spring are structured from the substrate. At least one separating trench which at least partially surrounds the movable mass is formed in the substrate. The at least one stator electrode is situated adjacent to an outer surface of the movable mass which is at least partially surrounded by the separating trench, with the aid of at least one supporting connection which connects the at least one stator electrode to an anchor situated on the substrate and spans a section of the separating trench. Also described is a manufacturing method for a micromechanical component.

US Patent:

20120261774, Oct 18, 2012

Filed:

Mar 21, 2012

Appl. No.:

13/425543

Inventors:

Andrew B. Graham - Redwood City CA, US
Gary Yama - Mountain View CA, US
Gary O'Brien - Palo Alto CA, US

Assignee:

ROBERT BOSCH GMBH - Stuttgart

International Classification:

H01L 29/84
H01L 21/02

US Classification:

257415, 438 50, 257E29324, 257E21002

Abstract:

A MEMS device structure including a lateral electrical via encased in a cap layer and a method for manufacturing the same. The MEMS device structure includes a cap layer positioned on a MEMS device layer. The cap layer covers a MEMS device and one or more MEMS device layer electrodes in the MEMS device layer. The cap layer includes at least one cap layer electrode accessible from the surface of the cap layer. An electrical via is encased in the cap layer extending across a lateral distance from the cap layer electrode to the one or more MEMS device layer electrodes. An isolating layer is positioned around the electrical via to electrically isolate the electrical via from the cap layer.

US Patent:

20120261822, Oct 18, 2012

Filed:

Sep 14, 2011

Appl. No.:

13/232005

Inventors:

Andrew B. Graham - Redwood City CA, US
Gary Yama - Mountain View CA, US
Gary O'Brien - Palo Alto CA, US

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 29/40
H01L 21/44

US Classification:

257741, 438597, 257E29111, 257E21476

Abstract:

In one embodiment, a method of forming an out-of-plane electrode includes providing an oxide layer above an upper surface of a device layer, providing a first cap layer portion above an upper surface of the oxide layer, etching a first electrode perimeter defining trench extending through the first cap layer portion and stopping at the oxide layer, depositing a first material portion within the first electrode perimeter defining trench, depositing a second cap layer portion above the first material portion, vapor releasing a portion of the oxide layer, depositing a third cap layer portion above the second cap layer portion, etching a second electrode perimeter defining trench extending through the second cap layer portion and the third cap layer portion, and depositing a second material portion within the second electrode perimeter defining trench, such that a spacer including the first material portion and the second material portion define out-of-plane electrode.

US Patent:

20120264250, Oct 18, 2012

Filed:

Sep 14, 2011

Appl. No.:

13/232073

Inventors:

Andrew B. Graham - Redwood City CA, US
Gary Yama - Mountain View CA, US
Gary O'Brien - Palo Alto CA, US

Assignee:

ROBERT BOSCH GMBH - Stuttgart

International Classification:

H01L 21/302

US Classification:

438 53, 257E21214

Abstract:

A method of modifying stress characteristics of a membrane in one embodiment includes providing a membrane layer, determining a desired stress modification, and forming at least one trough in the membrane layer based upon the determined desired stress modification.

US Patent:

20130111992, May 9, 2013

Filed:

Nov 9, 2012

Appl. No.:

13/673072

Inventors:

Robert Bosch GmbH - Stuttgart, DE
Gary O'Brien - Palo Alto CA, US

Assignee:

ROBERT BOSCH GMBH - Stuttgart

International Classification:

G01C 19/56
H01L 21/02
H01L 29/84

US Classification:

7350412, 257417, 438 50, 257E29324, 257E21002

Abstract:

A micro electromechanical system (MEMS) includes a substrate, a first curved surface located at a position above a surface of the substrate, and a second curved surface generally opposite to the first curved surface along a first axis parallel to the surface of the substrate, wherein the first curved surface is movable along the first axis in a direction toward the second curved surface.

US Patent:

20130115775, May 9, 2013

Filed:

Nov 9, 2012

Appl. No.:

13/673033

Inventors:

Robert Bosch GmbH - Stuttgart, DE
Gary O'Brien - Palo Alto CA, US

Assignee:

ROBERT BOSCH GMBH - Stuttgart

International Classification:

H01L 21/311

US Classification:

438702

Abstract:

A method of forming an encapsulated wide trench includes providing a silicon on oxide insulator (SOI) wafer, defining a first side of a first sacrificial silicon slab by etching a first trench in a silicon layer of the SOI wafer, defining a second side of the first sacrificial silicon slab by etching a second trench in the silicon layer, forming a first sacrificial oxide portion in the first trench, forming a second sacrificial oxide portion in the second trench, forming a polysilicon layer above the first sacrificial oxide portion and the second sacrificial oxide portion, and etching the first sacrificial oxide portion and the second sacrificial oxide portion.