Gary J O'Brien

US Patent:

6913941, Jul 5, 2005

Filed:

Sep 9, 2002

Appl. No.:

10/238062

Inventors:

Gary J. O'Brien - Gilbert AZ, US
David J. Monk - Mesa AZ, US

Assignee:

Freescale Semiconductor, Inc. - Schaumburg IL

International Classification:

H01L021/00

US Classification:

438 48, 438 50, 438 52

Abstract:

A method for creating a MEMS structure is provided. In accordance with the method, a substrate () is provided having a sacrificial layer () disposed thereon and having a layer of silicon () disposed over the sacrificial layer. A first trench () is created which extends through the silica layer and the sacrificial layer and which separates the sacrificial layer into a first region () enclosed by the first trench and a second region () exterior to the first trench. A first material () is deposited into the first trench such that the first material fills the first trench to a depth at least equal to the thickness of the sacrificial layer. A second trench () is created exterior to the first trench which extends through at least the silicon layer and exposes at least a portion of the second region of the sacrificial layer. The second region of the sacrificial layer is contacted, by way of the second trench, with a chemical etching solution adapted to etch the sacrificial layer, said etching solution being selective to the first material.

US Patent:

7005193, Feb 28, 2006

Filed:

Apr 29, 2003

Appl. No.:

10/426148

Inventors:

Andrew C. McNeil - Scottsdale AZ, US
Gary Li - Gilbert AZ, US
Gary J. O'Brien - Gilbert AZ, US

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B32B 15/00
G01P 15/02
C23F 1/00

US Classification:

428450, 428446, 7351401, 7351436, 7351438, 216 2, 216 99

Abstract:

A proof mass () for a MEMS device is provided herein. The proof mass comprises a base () comprising a semiconductor material, and at least one appendage () adjoined to said base by way of a stem (). The appendage () comprises a metal () or other such material that may be disposed on a semiconductor material (). The metal increases the total mass of the proof mass () as compared to a proof mass of similar dimensions made solely from semiconductor materials, without increasing the size of the proof mass. At the same time, the attachment of the appendage () by way of a stem () prevents stresses arising from CTE differentials in the appendage from being transmitted to the base, where they could contribute to temperature errors.

US Patent:

7095198, Aug 22, 2006

Filed:

Jun 16, 2005

Appl. No.:

11/156171

Inventors:

Gary O'Brien - Riverview MI, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

G01L 3/02
G01L 3/10
B25B 23/14

US Classification:

318432, 7386208, 73862336, 7386223, 32420725, 32420721, 32420713

Abstract:

A power sensor module suitable for automotive and other high volume applications combines speed sensing and torque sensing operations into a single unit. A magnetic speed sensor is utilized for speed sensing. A power measurement can be derived from torque and speed. Combining torque sensing and speed sensing within a single module instead of using separate modules for each allows for reducing redundancies and lowering cost.

US Patent:

7212935, May 1, 2007

Filed:

Dec 21, 2005

Appl. No.:

11/314677

Inventors:

Gary R. O'Brien - Riverview MI, US
George Edward Bown - Oxford, GB

Assignee:

Honeywell International, Inc. - Morriston NJ

International Classification:

G60K 28/16

US Classification:

702 87, 701 84, 701 87, 701 90, 180197, 477110

Abstract:

The invention relates to torque sensors or more particularly to automotive torque sensors which measure the torque transmitted at one or more positions within an automotive power train. The invention provides a method for zeroing an automotive power train torque sensor while a vehicle is moving during the zero torque condition.

US Patent:

7735351, Jun 15, 2010

Filed:

Oct 14, 2008

Appl. No.:

12/251100

Inventors:

Stephen Profit - Framingham MA, US
Gary O'Brien - Chandler AZ, US

Assignee:

MEMSIC, Inc. - Andover MA

International Classification:

G01M 13/00

US Classification:

73 1104, 73 1201

Abstract:

A system measures an amount of wear in athletic footwear by measuring the amount of shock transmitted to a user. The measured shock is used to indicate an amount of how much cushioning has been lost by the footwear. The amount of wear is proportional to the loss of cushioning and an increase in transmitted shock to the user.

US Patent:

7862229, Jan 4, 2011

Filed:

Aug 22, 2008

Appl. No.:

12/229525

Inventors:

Alexander Dribinsky - Naperville IL, US
Gregory P. Pucci - Batavia IL, US
Yongyao Cai - Acton MA, US
Mathew Varghese - Arlington MA, US
Gary J. O'Brien - Chandler AZ, US

Assignee:

Memsic, Inc. - Andover MA

International Classification:

G01K 3/00

US Classification:

374137, 374112, 374113, 374114, 327512

Abstract:

A system, device, and method for minimizing x-axis and/or y-axis offset shift due to internally produced as well as externally produced on chip temperature imbalances. At least one temperature gradient canceling device is disposed on a substrate including a temperature gradient sensitive device having at least one pair of sensors. Voltage signals generated by the temperature gradient canceling devices can be combined with voltage signals generated by each of the pair of sensors to account for the offset.

US Patent:

8426289, Apr 23, 2013

Filed:

Sep 14, 2011

Appl. No.:

13/232209

Inventors:

Andrew B. Graham - Redwood City CA, US
Gary Yama - Mountain View CA, US
Gary O'Brien - Palo Alto CA, US

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/76

US Classification:

438404, 438421, 438424, 438427, 257E21546

Abstract:

In one embodiment, a method of forming an insulating spacer includes providing a base layer, providing an intermediate layer above an upper surface of the base layer, etching a first trench in the intermediate layer, depositing a first insulating material portion within the first trench, depositing a second insulating material portion above an upper surface of the intermediate layer, forming an upper layer above an upper surface of the second insulating material portion, etching a second trench in the upper layer, and depositing a third insulating material portion within the second trench and on the upper surface of the second insulating material portion.

US Patent:

8580691, Nov 12, 2013

Filed:

Sep 14, 2011

Appl. No.:

13/232012

Inventors:

Andrew B. Graham - Redwood City CA, US
Gary Yama - Mountain View CA, US
Gary O'Brien - Palo Alto CA, US

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/302
H01L 21/461

US Classification:

438692, 438693, 216 89

Abstract:

A method of shaping a substrate in one embodiment includes providing a first support layer, providing a first shaping pattern on the first support layer, providing a substrate on the first shaping pattern, performing a first chemical mechanical polishing (CMP) process on the substrate positioned on the first shaping pattern, and removing the once polished substrate from the first shaping pattern.