Gary D Redding

US Patent:

7014527, Mar 21, 2006

Filed:

Dec 16, 2003

Appl. No.:

10/737517

Inventors:

Gary Daniel Redding - Victor NY, US

Assignee:

Xerox Corporation - Stamford CT

International Classification:

B24B 1/00

US Classification:

451 5, 451 8, 451 41

Abstract:

A method for testing dies using a machine grooved storage tray with vacuum channels. The method involves drawing a vacuum upon the dies while held in the storage tray and using an automated vision system to map the location of dies in the pockets of the storage tray. Using the map, the storage tray is maneuvered for 5 each individual die in relation to a test probe in order that contact and testing may be made between the discrete die and the test probe.

US Patent:

7207442, Apr 24, 2007

Filed:

Dec 16, 2003

Appl. No.:

10/736734

Inventors:

Gary Daniel Redding - Victor NY, US

Assignee:

Xerox Corporation - Stamford CT

International Classification:

B65D 6/04
B65D 85/86
B65D 1/36
B25B 11/00

US Classification:

206561, 206564, 206718, 269 16, 269 21, 220533

Abstract:

A die holding tray useful for testing a plurality of individual dies placed into the holding tray together with a method of making the same. The holding tray has machined lateral and longitudinal sets of grooves with one set of grooves filled with strips in order to form pockets from the unfilled grooves. Vacuum channels are formed into the bottom of the pockets, and dies are held in place during testing by the flatness of the pocket bottoms and a drawn vacuum. Several embodiments are disclosed, including machining grooves in a compliant layer.

US Patent:

7823266, Nov 2, 2010

Filed:

Jan 16, 2007

Appl. No.:

11/653399

Inventors:

Gary Daniel Redding - Victor NY, US

Assignee:

Xerox Corporation - Norwalk CT

International Classification:

B23P 19/02
B65D 6/04
B65D 85/86
B65D 1/36
B25B 11/00

US Classification:

29525, 29428, 29557, 29558

Abstract:

A die holding tray useful for testing a plurality of individual dies placed into the holding tray together with a method of making the same. The holding tray has machined lateral and longitudinal sets of grooves with one set of grooves filled with strips in order to form pockets from the unfilled grooves. Vacuum channels are formed into the bottom of the pockets, and dies are held in place during testing by the flatness of the pocket bottoms and a drawn vacuum. Several embodiments are disclosed, including machining grooves in a compliant layer.

US Patent:

8550601, Oct 8, 2013

Filed:

Mar 23, 2011

Appl. No.:

13/069732

Inventors:

Mark A. Cellura - Webster NY, US
Peter J. Nystrom - Webster NY, US
John Paul Meyers - Rochester NY, US
Gary Daniel Redding - Victor NY, US
Yuanjia Zhang - Rochester NY, US

Assignee:

Xerox Corporation - Norwalk CT

International Classification:

B41J 2/045

US Classification:

347 68, 347 70, 347 71, 347 72

Abstract:

An ink jet printhead including a plurality of piezoelectric elements and a photosensitive interstitial layer which fills spaces between each adjacent piezoelectric element. The ink jet printhead can be formed using a simplified method to pattern the photosensitive interstitial layer, and to remove a diaphragm attach material which covers a plurality of openings through a diaphragm using laser ablation.

US Patent:

8556611, Oct 15, 2013

Filed:

Jun 21, 2011

Appl. No.:

13/165785

Inventors:

Bryan R. Dolan - Rochester NY, US
Peter J. Nystrom - Webster NY, US
Gary D. Redding - Victor NY, US
Mark A. Cellura - Webster NY, US
John R. Andrews - Fairport NY, US

Assignee:

Xerox Corporation - Norwalk CT

International Classification:

B29C 43/20

US Classification:

425 89, 425128

Abstract:

A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.

US Patent:

8585183, Nov 19, 2013

Filed:

Mar 22, 2011

Appl. No.:

13/053968

Inventors:

Peter J. Nystrom - Webster NY, US
Mark A. Cellura - Webster NY, US
Gary Daniel Redding - Victor NY, US

Assignee:

Xerox Corporation - Norwalk CT

International Classification:

B41J 2/045

US Classification:

347 68

Abstract:

A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, and forming a plurality of patterned conductive traces on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.

US Patent:

8585187, Nov 19, 2013

Filed:

Apr 29, 2011

Appl. No.:

13/097182

Inventors:

Peter J. Nystrom - Webster NY, US
Gary D. Redding - Victor NY, US
Mark A. Cellura - Webster NY, US

Assignee:

Xerox Corporation - Norwalk CT

International Classification:

B41J 2/045
H01L 41/22

US Classification:

347 70, 29 2535

Abstract:

A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.

US Patent:

8608293, Dec 17, 2013

Filed:

Oct 24, 2011

Appl. No.:

13/279778

Inventors:

Gary D Redding - Victor NY, US
Bryan R Dolan - Rochester NY, US
Mark A Cellura - Webster NY, US
Peter J Nystrom - Webster NY, US

Assignee:

Xerox Corporation - Norwalk CT

International Classification:

B41J 2/045
B21D 51/16
B23P 17/00

US Classification:

347 68, 298901

Abstract:

Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.