Gary S Schulze

US Patent:

8365977, Feb 5, 2013

Filed:

Jul 25, 2012

Appl. No.:

13/557925

Inventors:

Dominick A. DeAngelis - Villanova PA, US
Gary W. Schulze - Bethlehem PA, US

Assignee:

Kulicke and Soffa Industries, Inc. - Fort Washington PA

International Classification:

B23K 1/06
B29C 65/08

US Classification:

228 11, 228 45, 1565801

Abstract:

A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.

US Patent:

20120125977, May 24, 2012

Filed:

Aug 10, 2010

Appl. No.:

13/388148

Inventors:

Dominick A. DeAngelis - Villanova PA, US
Gary W. Schulze - Bethlehem PA, US

Assignee:

KULICKE AND SOFFA INDUSTRIES, INC. - Fort Washignton PA

International Classification:

B23K 20/10
B23K 31/02

US Classification:

2281101, 228 11

Abstract:

A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.

US Patent:

20230112270, Apr 13, 2023

Filed:

Jun 21, 2022

Appl. No.:

17/844968

Inventors:

- Fort Washington PA, US
Gary W. Schulze - Fort Washington PA, US
Aashish Shah - Fort Washington PA, US

International Classification:

B23K 37/00

Abstract:

A method of installing a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with an installation tool; (b) engaging the wire bonding tool in an aperture of a transducer of a wire bonding system while the wire bonding tool is held by the installation tool; (c) securing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the installation tool.