Gary S Schulze

age ~69

from St John, VI

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Also known as:

Connected to:

Gary Schulze Phones & Addresses

Address:

Malvern, PA 19355

License #:

RS173476L - Expired

Category:

Real Estate Commission

Type:

Real Estate Salesperson-Standard

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Ultrasonic Transducers For Wire Bonding And Methods Of Forming Wire Bonds Using Ultrasonic Transducers
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US Patent:

8365977, Feb 5, 2013
Filed:

Jul 25, 2012
Appl. No.:

13/557925
Inventors:

Dominick A. DeAngelis - Villanova PA, US
Gary W. Schulze - Bethlehem PA, US
Assignee:

Kulicke and Soffa Industries, Inc. - Fort Washington PA
International Classification:

B23K 1/06
B29C 65/08
US Classification:

228 11, 228 45, 1565801
Abstract:

A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.

Ultrasonic Transducers For Wire Bonding And Methods Of Forming Wire Bonds Using Ultrasonic Transducers
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US Patent:

20120125977, May 24, 2012
Filed:

Aug 10, 2010
Appl. No.:

13/388148
Inventors:

Dominick A. DeAngelis - Villanova PA, US
Gary W. Schulze - Bethlehem PA, US
Assignee:

KULICKE AND SOFFA INDUSTRIES, INC. - Fort Washignton PA
International Classification:

B23K 20/10
B23K 31/02
US Classification:

2281101, 228 11
Abstract:

A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.

Methods Of Installing Wire Bonding Tools On Wire Bonding Systems, And Related Installation Tools And Systems
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US Patent:

20230112270, Apr 13, 2023
Filed:

Jun 21, 2022
Appl. No.:

17/844968
Inventors:

- Fort Washington PA, US
Gary W. Schulze - Fort Washington PA, US
Aashish Shah - Fort Washington PA, US
International Classification:

B23K 37/00
Abstract:

A method of installing a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with an installation tool; (b) engaging the wire bonding tool in an aperture of a transducer of a wire bonding system while the wire bonding tool is held by the installation tool; (c) securing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the installation tool.