Gary G Warren

US Patent:

7038288, May 2, 2006

Filed:

Sep 23, 2003

Appl. No.:

10/669081

Inventors:

Jay Jie Lai - Cerritos CA, US
Truc Q. Vu - Tustin CA, US
Gary B. Warren - Huntington Beach CA, US

Assignee:

Microsemi Corporation - Irvine CA

International Classification:

H01L 31/00

US Classification:

257448, 257443, 257434, 257457, 257459, 250239, 25037014, 438 29

Abstract:

This invention relates to a novel optoelectronic chip with one or more optoelectronic devices, such as photodiodes, fabricated on a front side of a semiconductor wafer and contacts on a backside of the semiconductor wafer. The backside contacts can be contact bumps, which allow the optoelectronic chip to achieve the benefits of flip chip packaging without flipping the optoelectronic chip upside down with respect to a chip carrier. In an optical communication system, a photodiode chip can be backside bumped to a chip carrier or an electronic chip, allowing front side illumination of the photodiode chip. Front side illumination offers many benefits, including improved fiber alignment, reduced manufacturing time, and overall cost reduction.

US Patent:

7479401, Jan 20, 2009

Filed:

Apr 28, 2006

Appl. No.:

11/414128

Inventors:

Jay Jie Lai - Cerritos CA, US
Truc Q. Vu - Tustin CA, US
Gary B. Warren - Huntington Beach CA, US

Assignee:

Microsemi Corporation - Irvine CA

International Classification:

H01L 21/00

US Classification:

438 48, 438 65, 257E21527

Abstract:

This invention relates to a novel optoelectronic chip with one or more optoelectronic devices, such as photodiodes, fabricated on a front side of a semiconductor wafer and contacts on a backside of the semiconductor wafer. The backside contacts can be contact bumps, which allow the optoelectronic chip to achieve the benefits of flip chip packaging without flipping the optoelectronic chip upside down with respect to a chip carrier. In an optical communication system, a photodiode chip can be backside bumped to a chip carrier or an electronic chip, allowing front side illumination of the photodiode chip. Front side illumination offers many benefits, including improved fiber alignment, reduced manufacturing time, and overall cost reduction.

US Patent:

20060255419, Nov 16, 2006

Filed:

Apr 28, 2006

Appl. No.:

11/413634

Inventors:

Jay Lai - Cerritos CA, US
Truc Vu - Tustin CA, US
Gary Warren - Huntington Beach CA, US

International Classification:

H01L 31/0203

US Classification:

257433000, 257737000, 257E31131, 438064000

Abstract:

This invention relates to a novel optoelectronic chip with one or more optoelectronic devices, such as photodiodes, fabricated on a front side of a semiconductor wafer and contacts on a backside of the semiconductor wafer. The backside contacts can be contact bumps, which allow the optoelectronic chip to achieve the benefits of flip chip packaging without flipping the optoelectronic chip upside down with respect to a chip carrier. In an optical communication system, a photodiode chip can be backside bumped to a chip carrier or an electronic chip, allowing front side illumination of the photodiode chip. Front side illumination offers many benefits, including improved fiber alignment, reduced manufacturing time, and overall cost reduction.