Eugene E Castellani

US Patent:

41027566, Jul 25, 1978

Filed:

Dec 30, 1976

Appl. No.:

5/755893

Inventors:

Eugene Evans Castellani - Putnam Valley NY
John Vincent Powers - Shenorock NY
Lubomyr Taras Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C25D 356
C25C 124
C25D 2114

US Classification:

204 43T

Abstract:

A thin film of low magnetostriction Permalloy 80% nickel - 20% iron. +-. 1% is electroplated in a bath having a ratio of about 1. 8:1 to 24:1 g/liter ratio of Ni to Fe ions with a plating current density from 10 ma/cm. sup. 2 - 200 ma/cm. sup. 2 when plating in sheet form or an Ni/Fe ratio of 25:1 to 85:1 with a current density of 2 ma/cm. sup. 2 - 110 ma/cm. sup. 2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.

US Patent:

42810574, Jul 28, 1981

Filed:

Feb 7, 1977

Appl. No.:

5/766308

Inventors:

Eugene E. Castellani - Putnam Valley NY
Ian M. Croll - Pleasantville NY
Aloysius T. Pfeiffer - Peekskill NY
Lubomyr T. Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03C 500
G03C 176
G03C 186
G03C 194

US Classification:

430270

Abstract:

Resist is applied to a surface with a syringe, or other suitable dropper, equipped with a millipore filter to remove contaminants. The surface is completely flooded with resist. Resist is allowed to remain on the surface of the evaporated metal for a period of time prior to spin coating. Allowing resist to remain on the surface prior to coating produces a uniform film. For a 2 micron thick uniform resist coating, a minimum of 15 seconds is allowed prior to spinning while in the case of a 4 micron thick resist coating a much longer period is allowed. For the application of a 2 micron film, the resist material after partial drying for approximately 15 seconds is spun at 2000 rpm for 30 seconds. In order to apply a 5 micron thick resist film, resist is spun at 2000 rpm for 30 seconds after partial drying for approximately 10 minutes.

US Patent:

43159850, Feb 16, 1982

Filed:

Dec 28, 1977

Appl. No.:

5/865344

Inventors:

Eugene E. Castellani - Putnam Valley NY
Ian M. Croll - Pleasantville NY
Aloysius T. Pfeiffer - Peekskill NY
Lubomyr T. Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03C 500
G03C 176

US Classification:

430314

Abstract:

A method is disclosed for the production of thick and smooth layers of photoresist on the order of 2-15 microns thick. The substrate is flooded with resist as in the standard spin resist method, but instead of following the flooding step with spinning as usual, the second step is to provide a drying time for the flooded resist. Then at the end of the measured drying time, the resist is spun as usual. This can be used to produce fine line closely spaced circuitry in which the thickness of the lines in proportion to their width, or their aspect ratio, is large. Aspect ratios greater than 0. 4 and as high as 1. 5 are contemplated by the invention.

US Patent:

40802671, Mar 21, 1978

Filed:

Dec 29, 1975

Appl. No.:

5/645108

Inventors:

Eugene E. Castellani - Putnam Valley NY
Patrick M. McCaffrey - Mahopac Falls NY
Aloysius T. Pfeiffer - Peekskill NY
Lubomyr T. Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C25D 502
C25D 108
C25D 120

US Classification:

204 15

Abstract:

A method of constructing a relatively thick, self-supporting mask suitable for electron beam projection processes. Thickness is achieved by multiple steps of coating with resist, exposure, development and plating. First an intermediate or lift off layer is deposited on a substrate. A plating or a cathode layer may then be deposited. Resist is then applied. A first mask layer comprises metal plated in accordance with the first pattern. For the second exposure a geometrically similar pattern is employed to generate larger apertures. Thus, if the first mask layer has 0. 20 mil apertures, the second layer might have corresponding 0. 21 mil to 0. 22 mil apertures. For initial mask patterns of about 2 mil the second layer might be 2. 02 mils. If desired, a third exposure can be employed with a third pattern, similar to the first two, but having larger apertures (by 0. 02 to 0. 03 mils) than the second pattern.

US Patent:

40037681, Jan 18, 1977

Filed:

Feb 12, 1975

Appl. No.:

5/549401

Inventors:

Ronald L. Anderson - Mountain View CA
Eugene E. Castellani - Putnam Valley NY
Patrick M. McCaffrey - Mahopac Falls NY
Lubomyr T. Romankiw - Briarcliff Manor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C21D 104

US Classification:

148108

Abstract:

A method for increasing the magnetic permeability of a magnetic alloy having an easy axis and a hard axis which comprises subjecting a body of the magnetic alloy to a magnetic field of at least about 40 Gauss oriented in the direction of the hard axis while the body is maintained at a temperature at or above that required to deposit the alloy on a substrate.