Geoffrey Laurence Green

US Patent:

20090114534, May 7, 2009

Filed:

Sep 2, 2008

Appl. No.:

12/203062

Inventors:

Geoffrey Green - Belmont CA, US

International Classification:

C23C 14/58
C23C 14/35

US Classification:

20429809, 20429816

Abstract:

Methods and devices are provided for improved sputtering systems. In one embodiment of the present invention, a sputtering system for use with a substrate is provided. The system comprises of a sputtering chamber; at least one magnetron disposed in the chamber; and at least one, non-convection based cooling system in the sputtering chamber. This system may optionally use at least one chilled roller positioned along the path of the substrate. This chilled roller may be in the sputtering chamber or optionally, outside the sputtering chamber. This system may optionally include at least one emissivity based cooling apparatus located within the chamber for drawing heat away from the substrate. In another embodiment the present invention, the sputtering system may use a non-convection, non-conduction system for cooling the substrate. The system may use a non-contact cooling system that is spaced apart from the substrate. This system may optionally include at least one emissivity based cooling apparatus located within the chamber for drawing heat away from the substrate. Optionally, outside the sputtering chamber, at least one chilled roller positioned along the path of the substrate to further cool the substrate.

US Patent:

20100300352, Dec 2, 2010

Filed:

Oct 17, 2008

Appl. No.:

12/738392

Inventors:

Yann Roussillon - Sunnyvale CA, US
Piyaphant Utthachoo - San Jose CA, US
Geoffrey T. Green - Belmont CA, US
Addison Shelton - Sunnyvale CA, US
Jeremy H. Scholz - Sunnyvale CA, US

International Classification:

B05C 3/02

US Classification:

118415

Abstract:

Methods and devices are provided for improved deposition systems. In one embodiment of the present invention, a deposition system is provided for use with a solution and a substrate. The system comprises of a solution deposition apparatus; at least one heating chamber; at least one assembly for holding a solution over the substrate; and a substrate curling apparatus for curling at least one edge of the substrate to define a zone capable of containing a volume of the solution over the substrate. In another embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.