George W Gilbert

US Patent:

55571441, Sep 17, 1996

Filed:

Jan 29, 1993

Appl. No.:

8/010733

Inventors:

Michael A. Rosenstock - Branchburg NJ
Phillip W. Wallace - Bernardsville NJ
John T. Bayruns - Chatham NJ
Kenneth S. Sanyigo - Fords NJ
George G. Gilbert - Lebanon NJ

Assignee:

Anadigics, Inc. - Warren NJ

International Classification:

H01L 23495

US Classification:

257668

Abstract:

A plastic package for microwave applications up to 14 Ghz is disclosed. The plastic package includes a plastic platform, a lead frame embedded on the surface of the platform and, in one embodiment, a plastic cap mounted on the platform so as to seal the chip within the package. The lead frame includes a baseplate for mounting at least one semiconductor chip, at least one ground lead attached to the baseplate and extending outwardly therefrom, and at least one signal lead for conducting signals to or from such semiconductor chip. The signal lead and at least one ground lead are configured as a microwave transmission line such as microwave coplanar strips, or microwave coplanar waveguide for transmitting microwave frequency signals. The package offers a low inductance ground path, good thermal characteristics, and low parasitic inductance and capacitance. It can be applied for high speed and high frequency applications.