George Joseph Purden

US Patent:

7324043, Jan 29, 2008

Filed:

Sep 2, 2005

Appl. No.:

11/219400

Inventors:

George J. Purden - Westlake Village CA, US
Shawn Shi - Thousand Oaks CA, US

Assignee:

Delphi Technologies, Inc. - Troy MI

International Classification:

G01S 7/28

US Classification:

342175, 342157, 342158, 342371, 342372, 343700 MS, 343853, 257275, 327237

Abstract:

A system and method for an electronically scanned antenna is provided in which phase shifters are deposited en masse along with other electronically scanned antenna components on a wafer scale substrate using a thin film process. Alternative wafer scale sizes may be utilized to furnish a required antenna aperture area. Significant processing costs for radar and communication systems are saved utilizing the present invention as compared with contemporary discrete phase shifters that are individually mounted on an antenna. In an aspect, the phase shifter is made up of a base electrode, a barium strontanate titanate (BST) ferroelectric varactor and a top electrode. The BST ferroelectric material is a voltage variable dielectric, which generates a radiation phase. The radiation phase is regulated by a phase shifter control. The radiation phase generates an electromagnetic field about a radiating element and electromagnetic radio waves are radiated from the radiating element.

US Patent:

20100200968, Aug 12, 2010

Filed:

Feb 12, 2010

Appl. No.:

12/704613

Inventors:

GEORGE J. PURDEN - WESTLAKE VILLAGE CA, US
MATTHEW R. WALSH - SHARPSVILLE IN, US
FRANZ JOSEF SCHMUECKLE - KOENIGS WUSTERHAUSEN, DE

Assignee:

DELPHI TECHNOLOGIES, INC. - TROY MI

International Classification:

H01L 23/498

US Classification:

257664, 257728, 257734, 257E2306

Abstract:

A microwave circuit assembly including a flip-chip attachable integrated circuit die attached to a substrate by an interconnect device. The integrated circuit die and the substrate have microstrip transmission lines that are electrically coupled through the interconnect device. The interconnect device forms a transmission line configured to electrically couple the microstrip transmission line on the substrate to the microstrip transmission line on the integrated circuit die The interconnect device includes stubs to enhance the ground elements of the interconnect device transmission line and provide a microwave short for the integrated circuit die.

US Patent:

20130127562, May 23, 2013

Filed:

Nov 18, 2011

Appl. No.:

13/299410

Inventors:

GEORGE J. PURDEN - WESTLAKE VILLAGE CA, US
DAVID W. ZIMMERMAN - FISHERS IN, US

Assignee:

DELPHI TECHNOLOGIES, INC. - TROY MI

International Classification:

H01P 5/107

US Classification:

333 26

Abstract:

A surface mountable transition block for perpendicular transitions between a microstrip or stripline and a waveguide. The transition block configuration allows for a reduction in the overall cost of a microwave circuit assembly because the circuit board to which the transition block is attached can be an FR-4 type circuit board as opposed to more expensive microwave circuit board materials.

US Patent:

53292553, Jul 12, 1994

Filed:

Sep 4, 1992

Appl. No.:

7/940580

Inventors:

James R. Hayes - Torrance CA
Steve R. Kasten - Carson CA
George J. Purden - Gardena CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H03B 504
H03B 518
H03B 712
H03B 714

US Classification:

331 96

Abstract:

A thermally compensating microwave cavity is provided. An active device that generates microwaves is disposed within this microwave cavity such that microwaves are emitted within the cavity. A first portion of these microwaves travels in one direction from the active device and forms a broad bandwidth signal. A section portion of the microwaves travels toward a reflecting member and is reflected. Once reflected, this second portion combines with and compensates the first portion. A temperature dependent bellows is utilized to displace the active device and the reflecting member relative to one another. Accordingly, as the signal emitted by the active device changes with temperature, the reflecting member is displaced by the bellows to properly reflect the second portion of the microwaves such that it combines with and properly compensates the signal.

US Patent:

20200287290, Sep 10, 2020

Filed:

Mar 7, 2019

Appl. No.:

16/295285

Inventors:

- St. Michael, BB
George J. Purden - Atascadero CA, US
Ryan K. Rossiter - Kokomo IN, US

International Classification:

H01Q 13/18
H01Q 1/50
H01Q 1/38

Abstract:

An illustrative example electronic device includes a signal generator having at least one conductive output member. A substrate integrated waveguide (SIW) includes a substrate and a plurality of conductive members in the substrate. The substrate includes a slot in one exterior surface of the substrate. The slot is situated adjacent the at least one conductive output member of the signal generator such that a signal of the signal generator is coupled into the SIW through the slot.

US Patent:

20190245257, Aug 8, 2019

Filed:

Mar 23, 2018

Appl. No.:

15/934126

Inventors:

- Troy MI, US
George J. Purden - Westlake Village CA, US
Shawn Shi - Thousand Oaks CA, US

International Classification:

H01P 1/16
H01P 3/12
H05K 1/11
H05K 1/02

Abstract:

A signal handling device includes a first substrate. A plurality of first conductors in the first substrate are arranged to form a substrate integrated waveguide. A second substrate includes a plurality of second conductors arranged to form a resonating cavity near one end of the substrate integrated waveguide. A signal carrier is aligned with the one end of the substrate integrated waveguide.