Glen E Novak

US Patent:

20040262782, Dec 30, 2004

Filed:

Jun 27, 2003

Appl. No.:

10/608702

Inventors:

Thomas Ellis - Romeo MI, US
Glen Novak - Romeo MI, US

International Classification:

H01L023/28

US Classification:

257/787000

Abstract:

Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an inorganic filler having a platelet geometric structure. The platelet structure of the filler allows a desirable coefficient of thermal expansion to be achieved using a very low level of filler material. This low level of filler material facilitates lower viscosity during forming of the encapsulation and/or overmolding, thereby facilitating complete filling of a mold cavity and underfilling of space between a circuit board and a semi-conductor chip electrically connected to the circuit board. In addition, the low viscosity has processing advantages that reduce the potential for damage to electrical components during encapsulation, overmolding and/or underfilling.

US Patent:

20170313002, Nov 2, 2017

Filed:

May 2, 2016

Appl. No.:

15/144625

Inventors:

- Detroit MI, US
- Osaka, JP
Elisabeth J. BERGER - Farmington Hills MI, US
William R. RODGERS - Bloomfield Township MI, US
Tomohiro RYUTANI - Rochester MI, US
Glen NOVAK - Bruce Township MI, US

Assignee:

GM Global Technology Operations LLC - Detroit MI
Teijin Limited - Osaka

International Classification:

B29C 73/10
B29C 35/08
B29C 35/08
B29C 70/44
B29K 105/00
B29K 101/12

Abstract:

Methods of repairing a defect in a polymeric composite structure are provided. The methods include disposing a patch over a defect in a polymeric composite structure; disposing a textured sheet over the polymeric patch, applying pressure to the polymeric patch and the textured sheet; and heating the polymeric patch. The textured sheet has a surface texture that is a negative of a surface texture of the polymeric composite structure.