Gregory W Pautsch

US Patent:

6345515, Feb 12, 2002

Filed:

Aug 21, 2000

Appl. No.:

09/642957

Inventors:

Gregory W. Pautsch - Chippewa Falls WI
William J. Matthews - Cornell WI
Rich Rineck - Chippewa Falls WI

Assignee:

Silicon Graphics, Inc. - Mountain View CA

International Classification:

F28D 500

US Classification:

62311, 62310, 62318

Abstract:

A conditioning and filling system includes a first processing section for degassing and dehydrating a working fluid, a second processing section for filtering the working fluid, and a monitoring section for sensing a condition of the working fluid, the monitoring section controlling a flow of the working fluid depending on the condition of the working fluid.

US Patent:

6366461, Apr 2, 2002

Filed:

Sep 29, 1999

Appl. No.:

09/408772

Inventors:

Gregory W. Pautsch - Chippewa Falls WI
Kent T. McDaniel - Altoona WI
Eric Dwayne Lakin - Chippewa Falls WI
James Joseph Jirak - Jim Falls WI

Assignee:

Silicon Graphics, Inc. - Mountain View CA

International Classification:

H05K 720

US Classification:

361690, 361688, 361689, 361692, 361699, 361703, 361704, 361719, 361720, 174 151, 174 161, 174 163, 165 803, 165 804

Abstract:

A system and method for cooling individual electronic components utilizes individual manifolds to create individual flows of a negatively pressurized cooling fluid. This permits components with significantly different cooling loads to be located immediately adjacent each other on a circuit board, but without loss of space and computation time efficiencies, because cooling the components individually avoids heat generated by each component from adversely affecting the performance of the cooling system for adjacent components. A heat sink can be coupled to the components for increased heat transfer, and a preferred design of heat sink both dissipates heat and directs the flow of the fluid in an optimum manner.

US Patent:

6580609, Jun 17, 2003

Filed:

Apr 8, 2002

Appl. No.:

10/118279

Inventors:

Gregory W. Pautsch - Chippewa Falls WI

Assignee:

Cray Inc. - Seattle WA

International Classification:

H05K 720

US Classification:

361698, 2989003, 622592, 165 804, 257714, 361700

Abstract:

A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.

US Patent:

D481035, Oct 21, 2003

Filed:

May 1, 2002

Appl. No.:

29/160077

Inventors:

Gregory W. Pautsch - Chippewa Falls WI
Dennis F. Girling - Chippewa Falls WI

Assignee:

Cray Inc. - Seattle WA

International Classification:

1402

US Classification:

D14310

US Patent:

D481040, Oct 21, 2003

Filed:

May 1, 2002

Appl. No.:

29/160081

Inventors:

Gregory W. Pautsch - Chippewa Falls WI
Jill Antolak - Chippewa Falls WI

Assignee:

Cray Inc. - Seattle WA

International Classification:

1402

US Classification:

D14444

US Patent:

6646879, Nov 11, 2003

Filed:

May 16, 2001

Appl. No.:

09/860038

Inventors:

Gregory W. Pautsch - Chippewa Falls WI

Assignee:

Cray Inc. - Seattle WA

International Classification:

H05K 720

US Classification:

361699, 361689, 361698, 361701, 361704, 361700, 174 151, 165 804, 16510433, 62 64, 622592

Abstract:

A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.

US Patent:

7478769, Jan 20, 2009

Filed:

Mar 9, 2005

Appl. No.:

11/075832

Inventors:

Gregory W. Pautsch - Chippewa Falls WI, US
Adam Pautsch - Madison WI, US

Assignee:

Cray Inc. - Seattle WA

International Classification:

B05B 1/14
B05B 1/34
F25D 23/12
F28D 15/00
H05K 7/20

US Classification:

239555, 239 11, 239462, 239463, 2395533, 622592, 16510433, 361699

Abstract:

A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery device. The spray delivery device includes one or more inlet apertures and one or more corresponding outlet apertures, at least one pair of inlet aperture and corresponding outlet aperture being positioned relative to each so as to form an asymmetric non-uniform density full-cone spray pattern.

US Patent:

7757497, Jul 20, 2010

Filed:

Jan 19, 2009

Appl. No.:

12/356020

Inventors:

Gregory W. Pautsch - Chippewa Falls WI, US
Adam Pautsch - Madison WI, US

Assignee:

Cray Inc. - Seattle WA

International Classification:

F25D 17/02
F25D 31/00
F25D 23/12
B05B 17/04
B05B 1/34
B05B 1/14
H05K 7/20
F28D 15/00

US Classification:

62 64, 622592, 239 11, 239463, 239555, 361699, 16510433

Abstract:

A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery device. The spray delivery device includes one or more inlet apertures and one or more corresponding outlet apertures, at least one pair of inlet aperture and corresponding outlet aperture being positioned relative to each so as to form an asymmetric non-uniform density full-cone spray pattern.