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Gregory W Pautsch

age ~68

from Chippewa Falls, WI

Also known as:
  • Greg Pautsch
21463 40Th Ave, Hallie, WI 54729(715)7262226

Gregory Pautsch Phones & Addresses

  • 21463 40Th Ave, Chippewa Falls, WI 54729 • (715)7262226
  • Hayward, WI

Work

  • Position:
    Professional/Technical

Education

  • Degree:
    Associate degree or higher
Name / Title
Company / Classification
Phones & Addresses
Gregory W. Pautsch
Director of Engineering
Cray Inc
Computer Systems Design Mfg Electronic Computers Mfg Computer Peripheral Equipment
1050 Lowater Rd, Eau Claire, WI 54729
PO Box 6000, Eau Claire, WI 54729
(715)7264000

Us Patents

  • Conditioning And Filling System For A Spray Evaporative Cooling Working Fluid

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  • US Patent:
    6345515, Feb 12, 2002
  • Filed:
    Aug 21, 2000
  • Appl. No.:
    09/642957
  • Inventors:
    Gregory W. Pautsch - Chippewa Falls WI
    William J. Matthews - Cornell WI
    Rich Rineck - Chippewa Falls WI
  • Assignee:
    Silicon Graphics, Inc. - Mountain View CA
  • International Classification:
    F28D 500
  • US Classification:
    62311, 62310, 62318
  • Abstract:
    A conditioning and filling system includes a first processing section for degassing and dehydrating a working fluid, a second processing section for filtering the working fluid, and a monitoring section for sensing a condition of the working fluid, the monitoring section controlling a flow of the working fluid depending on the condition of the working fluid.
  • System And Method For Cooling Electronic Components

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  • US Patent:
    6366461, Apr 2, 2002
  • Filed:
    Sep 29, 1999
  • Appl. No.:
    09/408772
  • Inventors:
    Gregory W. Pautsch - Chippewa Falls WI
    Kent T. McDaniel - Altoona WI
    Eric Dwayne Lakin - Chippewa Falls WI
    James Joseph Jirak - Jim Falls WI
  • Assignee:
    Silicon Graphics, Inc. - Mountain View CA
  • International Classification:
    H05K 720
  • US Classification:
    361690, 361688, 361689, 361692, 361699, 361703, 361704, 361719, 361720, 174 151, 174 161, 174 163, 165 803, 165 804
  • Abstract:
    A system and method for cooling individual electronic components utilizes individual manifolds to create individual flows of a negatively pressurized cooling fluid. This permits components with significantly different cooling loads to be located immediately adjacent each other on a circuit board, but without loss of space and computation time efficiencies, because cooling the components individually avoids heat generated by each component from adversely affecting the performance of the cooling system for adjacent components. A heat sink can be coupled to the components for increased heat transfer, and a preferred design of heat sink both dissipates heat and directs the flow of the fluid in an optimum manner.
  • Method And Apparatus For Cooling Electronic Components

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  • US Patent:
    6580609, Jun 17, 2003
  • Filed:
    Apr 8, 2002
  • Appl. No.:
    10/118279
  • Inventors:
    Gregory W. Pautsch - Chippewa Falls WI
  • Assignee:
    Cray Inc. - Seattle WA
  • International Classification:
    H05K 720
  • US Classification:
    361698, 2989003, 622592, 165 804, 257714, 361700
  • Abstract:
    A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.
  • System Chassis

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  • US Patent:
    D481035, Oct 21, 2003
  • Filed:
    May 1, 2002
  • Appl. No.:
    29/160077
  • Inventors:
    Gregory W. Pautsch - Chippewa Falls WI
    Dennis F. Girling - Chippewa Falls WI
  • Assignee:
    Cray Inc. - Seattle WA
  • International Classification:
    1402
  • US Classification:
    D14310
  • Panel For A System Chassis

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  • US Patent:
    D481040, Oct 21, 2003
  • Filed:
    May 1, 2002
  • Appl. No.:
    29/160081
  • Inventors:
    Gregory W. Pautsch - Chippewa Falls WI
    Jill Antolak - Chippewa Falls WI
  • Assignee:
    Cray Inc. - Seattle WA
  • International Classification:
    1402
  • US Classification:
    D14444
  • Spray Evaporative Cooling System And Method

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  • US Patent:
    6646879, Nov 11, 2003
  • Filed:
    May 16, 2001
  • Appl. No.:
    09/860038
  • Inventors:
    Gregory W. Pautsch - Chippewa Falls WI
  • Assignee:
    Cray Inc. - Seattle WA
  • International Classification:
    H05K 720
  • US Classification:
    361699, 361689, 361698, 361701, 361704, 361700, 174 151, 165 804, 16510433, 62 64, 622592
  • Abstract:
    A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.
  • Method And Apparatus For Cooling Electronic Components

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  • US Patent:
    7478769, Jan 20, 2009
  • Filed:
    Mar 9, 2005
  • Appl. No.:
    11/075832
  • Inventors:
    Gregory W. Pautsch - Chippewa Falls WI,
    Adam Pautsch - Madison WI,
  • Assignee:
    Cray Inc. - Seattle WA
  • International Classification:
    B05B 1/14
    B05B 1/34
    F25D 23/12
    F28D 15/00
    H05K 7/20
  • US Classification:
    239555, 239 11, 239462, 239463, 2395533, 622592, 16510433, 361699
  • Abstract:
    A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery device. The spray delivery device includes one or more inlet apertures and one or more corresponding outlet apertures, at least one pair of inlet aperture and corresponding outlet aperture being positioned relative to each so as to form an asymmetric non-uniform density full-cone spray pattern.
  • Method And Apparatus For Cooling Electronic Components

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  • US Patent:
    7757497, Jul 20, 2010
  • Filed:
    Jan 19, 2009
  • Appl. No.:
    12/356020
  • Inventors:
    Gregory W. Pautsch - Chippewa Falls WI,
    Adam Pautsch - Madison WI,
  • Assignee:
    Cray Inc. - Seattle WA
  • International Classification:
    F25D 17/02
    F25D 31/00
    F25D 23/12
    B05B 17/04
    B05B 1/34
    B05B 1/14
    H05K 7/20
    F28D 15/00
  • US Classification:
    62 64, 622592, 239 11, 239463, 239555, 361699, 16510433
  • Abstract:
    A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery device. The spray delivery device includes one or more inlet apertures and one or more corresponding outlet apertures, at least one pair of inlet aperture and corresponding outlet aperture being positioned relative to each so as to form an asymmetric non-uniform density full-cone spray pattern.

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