Hee Won Kim

Address:

3422 Bellwood Ln, Glenview, IL 60026

VIN:

5NPEB4ACXBH108504

Make:

HYUNDAI

Model:

SONATA

Year:

2011

US Patent:

7990524, Aug 2, 2011

Filed:

Jun 29, 2007

Appl. No.:

11/771064

Inventors:

Justin E. Jureller - Chicago IL, US
Hee Y. Kim - Chicago IL, US
Norbert F. Scherer - Winnetka IL, US

Assignee:

The University of Chicago - Chicago IL

International Classification:

G01N 1/00

US Classification:

356 36

Abstract:

A rapid-sampling stochastic scanning multiphoton multifocal microscopy (SS-MMM) fluorescence imaging technique enables multiparticle tracking at rates upwards of 1,000 times greater than conventional single point raster scanning. Stochastic scanning of a diffractive optical element may generate a 10×10 hexagonal array of foci with a white noise driven galvanometer to yield a scan pattern that is random yet space-filling. SS-MMM may create a more uniformly sampled image with fewer spatio-temporal artifacts than obtained by conventional or multibeam raster scanning.

US Patent:

8043464, Oct 25, 2011

Filed:

Nov 17, 2009

Appl. No.:

12/620490

Inventors:

Hee Kyung Kim - El Segundo CA, US
Fangchou Yang - Los Angeles CA, US
Alberto F. Viscarra - Torrance CA, US
Clifton Quan - Arcadia CA, US
Derek Pruden - Redondo Beach CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

B32B 37/00
B29C 65/00
C09J 5/04
H01Q 13/10

US Classification:

156292, 156182, 156314, 343770

Abstract:

Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.

US Patent:

20130319732, Dec 5, 2013

Filed:

Apr 18, 2013

Appl. No.:

13/865730

Inventors:

Hee Kyung Kim - El Segundo CA, US
Fangchou Yang - Los Angeles CA, US
Kevin C. Rolston - Westchester CA, US
Edward Marsh Jackson - Long Beach CA, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

H05K 1/02

US Classification:

174254

Abstract:

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

US Patent:

20210312058, Oct 7, 2021

Filed:

Apr 7, 2020

Appl. No.:

16/842092

Inventors:

- Northbrook IL, US
William Anthony McCormick - Belfast, IE
Nathan Edward Shock - Aurora IL, US
Elizabeth Ann Kovick - Burbank IL, US
Keling Chen - Scottsdale AZ, US
Hee Yeun Kim - Frisco TX, US
Ryan Kresse - Pittsburgh PA, US
Edward Jay Sabijon - Charleston SC, US

International Classification:

G06F 21/57
G06N 20/00
G06Q 10/06

Abstract:

Methods, computer-readable media, software, and apparatuses may retrieve, from an industry standard setting scoring system and for a vulnerability, a temporal score based on a pre-revision version of a scoring system, and predict, based on a machine learning model and based on the temporal score for the vulnerability, an updated temporal score based on a post-revision version of the scoring system. A mitigating factor score, indicative of a mitigation applied to the vulnerability by an enterprise organization, may be determined. A risk score may be generated for each vulnerability, as a composite of the updated temporal score and the mitigating factor score. The risk scores for vulnerabilities in a collection of vulnerabilities may be aggregated to determine an enterprise risk score for the enterprise organization. In some instances, the enterprise risk score may be displayed via a graphical user interface.