Hee Young Kim

US Patent:

8362856, Jan 29, 2013

Filed:

Nov 17, 2009

Appl. No.:

12/620467

Inventors:

Clifton Quan - Arcadia CA, US
Fangchou Yang - Los Angeles CA, US
Hee Kyung Kim - El Segundo CA, US
Alberto F. Viscarra - Torrance CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H03H 7/38

US Classification:

333238, 333 33

Abstract:

A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line.

US Patent:

8547280, Oct 1, 2013

Filed:

Jul 14, 2010

Appl. No.:

12/836442

Inventors:

Fangchou Yang - Los Angeles CA, US
Hee Kyung Kim - El Segundo CA, US
Clifton Quan - Arcadia CA, US
Alberto F. Viscarra - Torrance CA, US
Robert W. Ladera - Fullerton CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01Q 1/38

US Classification:

343700MS, 343789, 343898

Abstract:

Provided is a radiator transition assembly for exciting a long slot radiator of an antenna, the transition assembly including a folded flexible circuit substrate including at least two folds forming a long slot radiator, an excitation circuitry configured to generate signals for exciting the long slot radiator, and a microstrip transmission line coupled to the excitation circuitry and positioned along the folded flexible circuit substrate, where the microstrip transmission line extends across an opening of the long slot radiator.

US Patent:

8043464, Oct 25, 2011

Filed:

Nov 17, 2009

Appl. No.:

12/620490

Inventors:

Hee Kyung Kim - El Segundo CA, US
Fangchou Yang - Los Angeles CA, US
Alberto F. Viscarra - Torrance CA, US
Clifton Quan - Arcadia CA, US
Derek Pruden - Redondo Beach CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

B32B 37/00
B29C 65/00
C09J 5/04
H01Q 13/10

US Classification:

156292, 156182, 156314, 343770

Abstract:

Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.

US Patent:

20110024160, Feb 3, 2011

Filed:

Jul 31, 2009

Appl. No.:

12/534077

Inventors:

Clifton Quan - Arcadia CA, US
Hee Kyung Kim - El Segundo CA, US
Fangchou Yang - Los Angeles CA, US
Kevin C. Rolston - Westchester CA, US
Edward Marsh Jackson - Long Beach CA, US

International Classification:

H05K 1/00
H05K 3/36

US Classification:

174254, 29830, 29846, 174261

Abstract:

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.

US Patent:

20130082893, Apr 4, 2013

Filed:

Sep 30, 2011

Appl. No.:

13/249491

Inventors:

Allen Wang - Fullerton CA, US
Fangchou Yang - Los Angeles CA, US
Hee Kyung Kim - El Segundo CA, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

H01Q 21/24

US Classification:

343810, 343848

Abstract:

Provided herein are devices, systems and techniques for establishing a coincident-phased dual polarization array aperture enabling a wide scan capability, while also presenting a bandwidth of at least about 40%. Radiating elements of such an array include a first ground plane extending between lower and upper edges and a first radiating element positioned above the upper edge of the first ground plane. The array elements also include a second ground plane extending between respective lower and upper edges and disposed substantially orthogonal to the first ground plane. A second radiating element is positioned above the upper edge of the second ground plane, such that the first and second radiating elements have different polarizations.Parallel ground planes of adjacent antenna elements of an array of like elements enhance array performance by providing isolation between such radiating elements and backplane ground by way of a phenomenon generally known as waveguide-below-cutoff.

US Patent:

20130319732, Dec 5, 2013

Filed:

Apr 18, 2013

Appl. No.:

13/865730

Inventors:

Hee Kyung Kim - El Segundo CA, US
Fangchou Yang - Los Angeles CA, US
Kevin C. Rolston - Westchester CA, US
Edward Marsh Jackson - Long Beach CA, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

H05K 1/02

US Classification:

174254

Abstract:

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.