Henry W Gale

US Patent:

20080254272, Oct 16, 2008

Filed:

Apr 30, 2008

Appl. No.:

12/112693

Inventors:

Guy M. Danner - Somerville MA, US
Matthew Joseph Kayal - Franklin MA, US
Henry Ware Gale - Westwood MA, US

Assignee:

E INK CORPORATION - Cambridge MA

International Classification:

B32B 7/12
B32B 5/00
B32B 37/00

US Classification:

428220, 428354, 156 60

Abstract:

A multi-layer film (), useful as a barrier film in electro-optic displays, comprises a light-transmissive adhesive layer (), a light-transmissive first protective layer (), a light-transmissive first moisture barrier layer (B), an intermediate layer (typically an adhesive layer) (), a light-transmissive second moisture barrier layer (A) and a light-transmissive second protective layer (). The second protective layer may be covered by a hard coat () and/or a masking film ().

US Patent:

20180196326, Jul 12, 2018

Filed:

Apr 7, 2017

Appl. No.:

15/482257

Inventors:

- Billerica MA, US
George G. HARRIS - Woburn MA, US
Keith A. JACOBSEN - Walpole MA, US
Henry Ware GALE - Westwood MA, US

International Classification:

G02F 1/167
H05K 3/04
H05K 3/40
H05K 3/02
H05K 1/11
G02F 1/1345
G02F 1/1362

Abstract:

The subject matter presented herein relates to a method for producing a backplane for electro-optic displays. The method may include providing a substrate coated with a first conductive material on a first side and a second conductive material on a second side, the second side being positioned opposite from the first side, patterning the first conductive material by cutting through the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit and creating a plurality of vias on the substrate, the plurality of vias extending through the substrate and providing electrical conductivity between the first and second sides. The method may further include creating a plurality of conductive traces on the second side of the substrate by patterning the second conductive material by locally align the vias to the driver circuit.