Herbert Carl Cook

US Patent:

57190704, Feb 17, 1998

Filed:

Oct 2, 1996

Appl. No.:

8/720852

Inventors:

Herbert Carl Cook - Jericho VT
Paul Alden Farrar - South Burlington VT
Robert Michael Geffken - Burlington VT
William Thomas Motsiff - Essex Junction VT
Adolf Ernest Wirsing - South Hero VT

Assignee:

International Business Machines Corporaton - Armonk NY

International Classification:

H01L 21283

US Classification:

437183

Abstract:

A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.

US Patent:

44344783, Feb 28, 1984

Filed:

Nov 27, 1981

Appl. No.:

6/325479

Inventors:

Herbert C. Cook - Georgia VT
Ronald R. Troutman - Essex Junction VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11C 1140

US Classification:

365185

Abstract:

A memory system is provided wherein extended injection-limited programming techniques attain a substantially uniform programming behavior from an ensemble of fabricated devices or cells to provide the maximum obtainable voltage threshold shift within a minimum time period. In order to produce these desired results, a floating gate of a device is charged by applying to the control gate of the device a first voltage during a portion of this time period which produces an accelerating field in a dielectric layer disposed adjacent to the floating gate and then applying to the control gate during the remaining portion of this time period a second voltage of greater magnitude than that of the first voltage prior to or when the accumulation of charge on the floating gate causes a retarding field to be established in the dielectric layer.

US Patent:

54573459, Oct 10, 1995

Filed:

Jan 14, 1994

Appl. No.:

8/182310

Inventors:

Herbert C. Cook - Jericho VT
Paul A. Farrar - South Burlington VT
Robert M. Geffken - Burlington VT
William T. Motsiff - Essex Junction VT
Adolf E. Wirsing - South Hero VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348
H01L 2946
H01L 2954
H01L 2962

US Classification:

257766

Abstract:

A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.