Herman C Chu

US Patent:

6352103, Mar 5, 2002

Filed:

May 20, 1997

Appl. No.:

08/859154

Inventors:

Herman W. Chu - Palo Alto CA
Rakesh Bhatia - Austin TX

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

F28F 700

US Classification:

165 803, 165185, 16510433, 165122, 165121, 257722, 257715, 361687, 361697, 174 152, 174 163

Abstract:

The invention consists of a modular apparatus for cooling an integrated circuit chip in a compact computer. The apparatus includes a heat collector assembly operatively connected to the chip, a heat exchange assembly and a heat pipe extending from the heat collector assembly to the heat exchange assembly. The heat exchange assembly includes a primary housing, a fan at one end of the housing, and a secondary housing at the opposite end of the primary housing. The secondary housing has a plurality of fins and the primary housing as a plenum chamber between the fins and the fan. The invention also comprises a high-performance notebook computer and cooling apparatus combination which includes a pivoted outer cover and a cooling system located along the pivoting axis of the outer cover.

US Patent:

6643128, Nov 4, 2003

Filed:

Jul 13, 2001

Appl. No.:

09/904928

Inventors:

Herman W. Chu - Palo Alto CA
Eugene Chung - San Jose CA
Robert J. Thomas - San Jose CA
Myron R. Tuttle - Santa Clara CA
Samuel M. S. Lee - San Jose CA

Assignee:

Hewlett-Packard Development Company, LP. - Houston TX

International Classification:

G06F 116

US Classification:

361687, 361695, 318471

Abstract:

A method and system of controlling a cooling fan of a computer system including a power supply unit. The method includes sensing a power load of the power supply unit. A reference air temperature of the computer system is also sensed. Finally, a fan setting is determined based upon the sensed power load and the sensed reference air temperature. By basing the fan setting on both reference temperature and actual power supply load, the method and system effectively minimizes cooling fan operation, and thus resulting acoustic noise, when a computer system is operating at less than full capacity. In one preferred embodiment, a look-up table is provided in which a plurality of fan settings are included, each fan setting being based upon a correlation of power supply load and reference temperature. The method and system of the present invention is particularly useful with high-end, server-type computer systems being used for low-end applications, and is readily applied to multiple platforms.

US Patent:

60757027, Jun 13, 2000

Filed:

May 26, 1999

Appl. No.:

9/318569

Inventors:

Susannah Gardner - San Carlos CA
Herman Wai-Tong Chu - Palo Alto CA
Gwen M. Bertolami - Menlo Park CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H05K 720

US Classification:

361704

Abstract:

A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.

US Patent:

20210278885, Sep 9, 2021

Filed:

Mar 9, 2020

Appl. No.:

16/813590

Inventors:

- Santa Clara CA, US
Susheela N. Narasimhan - Fremont CA, US
Reza Azizian - San Jose CA, US
Herman W. Chu - Palo Alto CA, US

International Classification:

G06F 1/20
H05K 7/20

Abstract:

Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.