Hiral Mahesh Ajmera

US Patent:

20040222101, Nov 11, 2004

Filed:

Apr 14, 2004

Appl. No.:

10/824718

Inventors:

Hiral Ajmera - Sunnyvale CA, US
Roman Mostovoy - San Francisco CA, US
Glen Mori - Pacifica CA, US

Assignee:

Applied Materials, Inc.

International Classification:

C25D005/34

US Classification:

205/099000, 205/101000

Abstract:

Embodiments of the invention provide a method for removing contaminants from a plating bath contained in a weir-type plater during idle times. The method broadly includes positioning a lower portion of a substrate support assembly into the plating bath and rotating the substrate support assembly at a rotation rate of between about 1 rpm and about 60 rpm for between about 5 seconds and about 30 seconds to circulate the plating solution such that contaminants accumulating on the surface of the plating solution are urged to flow over a weir of the weir-type plater.

US Patent:

20030150734, Aug 14, 2003

Filed:

Feb 11, 2002

Appl. No.:

10/074489

Inventors:

Rajeev Bajaj - Fremont CA, US
Ramin Emami - San Jose CA, US
Girish Dixit - San Jose CA, US
Hiral Ajmera - Sunnyvale CA, US
Roman Mostovoy - San Francisco CA, US

Assignee:

Applied Materials, Inc.

International Classification:

C25D021/06
C25D021/16
C25D017/00

US Classification:

205/098000, 204/276000, 205/099000

Abstract:

A method and apparatus for removing degraded organics from an electroplating solution by passing at least a portion of electroplating solution through a filter. The apparatus generally includes a deposition cell including a fluid inlet, a fluid reservoir, and at least one filter disposed between the reservoir and the fluid inlet. The apparatus may further include a control valve disposed between the fluid reservoir and the fluid inlet for passing at least a portion of an electroplating solution to a recovery stream including the at least one filter. Embodiments of the invention further include a method generally including the steps of providing a substrate having a seed layer disposed on a surface thereof, disposing the substrate in an electroplating solution, flowing a portion of the electroplating solution through a filter in an amount sufficient to remove an amount of organic additives from the electroplating solution equal to a calculated rate of organic additive degradation, and flowing the electroplating solution to the substrate.