Hong Bin Xie

US Patent:

59562293, Sep 21, 1999

Filed:

Apr 1, 1998

Appl. No.:

9/053238

Inventors:

Michael Brownell - Los Gatos CA
Dan McCutchan - Redwood City CA
Hong Xie - Chandler AZ
Kevin Haley - San Jose CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361699

Abstract:

A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled to the circuit board, the heatpipe is thermally coupled to the integrated circuit package. The plastic mold is lightweight and relatively inexpensive to produce. The mold also provides enough structural rigidity to prevent warping of the heatpipe.

US Patent:

61669083, Dec 26, 2000

Filed:

Oct 1, 1999

Appl. No.:

9/409752

Inventors:

Bill Samaras - San Jose CA
Michael Brownell - Los Gatos CA
Dan R. McCutchan - Redwood City CA
Hong Xie - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361700

Abstract:

An integrated circuit cartridge has been described. The cartridge includes a heat pipe lid that comes in thermal contact with at least one integrated circuit die. The integrated circuit die is mounted on a substrate that is held in a cavity of a pin chassis that has a grid array of pins for interconnection with a socket. The integrated circuit die can be mounted on a secondary substrate that is mounted to a primary substrate. The substrate has an edge connector to supply power to the integrated circuit die, freeing the grid array of pins to be used for signal interconnects. The substrate has a grid of connections soldered to the grid array of pins on the pin chassis. The pin chassis also supplies key structures that aid in alignment of the pins and a socket.

US Patent:

56216130, Apr 15, 1997

Filed:

Jul 15, 1996

Appl. No.:

8/683022

Inventors:

Kevin Haley - San Jose CA
Mostafa Aghazadeh - Chandler AZ
Hong Xie - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361687

Abstract:

A heat transfer apparatus providing thermal coupling between a first and a second hinged member. The first hinged member is a first computer housing member, and the second hinged member is a second computer housing member. The first and the second computer housing members are rotatably attached allowing pivotal motion along an axis substantially parallel to the first edge. A first embodiment has a spiraled heat transfer element with a inner edge thermally coupled to a heat conductive mounting element mounted along the first edge of the first computer housing member. The spiraled heat transfer element forms at least one turn around the heat conductive mounting element and has outer edge affixed to the second computer housing member. A second embodiment provides heat transfer between the first and second computer housing members through the gudgeon and the pintle of the hinge.