Hong F Xie

US Patent:

6493223, Dec 10, 2002

Filed:

Jun 28, 2000

Appl. No.:

09/606840

Inventors:

Ram S. Viswanath - Phoenix AZ
Hong Xie - Phoenix AZ
Robert Sankman - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361690, 361683, 361687, 16510433, 622591

Abstract:

The invention provides a computer with refrigeration. The computer has a housing, a processor, a refrigeration loop and a fan. The processor is located within the housing at a location distant from an air inlet into the housing. The refrigeration loop includes a compressor, a condenser, and expansion valve and an evaporator located in line one after the other. The evaporator is near the air inlet. The fan causes movement of air through the housing. The air passes over the evaporator to cool the air and the processor is primarily cooled by the air.

US Patent:

6558169, May 6, 2003

Filed:

Mar 29, 2001

Appl. No.:

09/821699

Inventors:

David G. Figueroa - Mesa AZ
Yuan-Liang Li - Chandler AZ
Hong Xie - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 1200

US Classification:

439 70, 361776

Abstract:

An apparatus includes a socket and a housing. The socket and the housing can define an interior region for receiving an integrated circuit package. The housing includes a conductive member with a first portion exposed adjacent a bottom surface of the housing and a second portion at a side surface adjacent the interior region. The first portion can be electrically in contact with a printed circuit board. The second portion can be electrically in contact with a conductive member at a side surface of the integrated circuit package.

US Patent:

6563703, May 13, 2003

Filed:

Dec 27, 2000

Appl. No.:

09/751715

Inventors:

Hong Xie - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 116

US Classification:

361687, 361686, 361696, 710303, 174 152, 64 32

Abstract:

An apparatus, comprising a portable module to cool, comprising a cooling device and a thermal connector.

US Patent:

6575766, Jun 10, 2003

Filed:

Feb 26, 2002

Appl. No.:

10/082881

Inventors:

Hong Xie - Phoenix AZ
Ram Viswanath - Phoenix AZ
PR Patel - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 1200

US Classification:

439 70, 439884

Abstract:

A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.

US Patent:

6672880, Jan 6, 2004

Filed:

Dec 19, 2002

Appl. No.:

10/325213

Inventors:

Hong Xie - Phoenix AZ
Ram Viswanath - Phoenix AZ
PR Patel - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 1200

US Classification:

439 70

Abstract:

A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.

US Patent:

6672891, Jan 6, 2004

Filed:

Sep 28, 2001

Appl. No.:

09/967060

Inventors:

Hong Xie - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 1362

US Classification:

439260, 439266

Abstract:

A device and method are for increasing the normal force on a substrate power connector. The device includes an edge-type substrate, a socket housing and an actuator. The socket housing receives the edge-type substrate with a zero insertion force or a low insertion force, and the actuator increases a normal force between the socket housing and the substrate to electrically couple the socket and the substrate. A method of creating a power connection includes inserting an edge-type substrate into a socket housing and activating an actuator to increase a normal force between the socket the substrate.

US Patent:

6710444, Mar 23, 2004

Filed:

Mar 21, 2002

Appl. No.:

10/101739

Inventors:

Hong Xie - Phoenix AZ
Debendra Mallik - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2334

US Classification:

257723, 257724, 257779, 257772

Abstract:

A molded stiffener for a package substrate is presented. The stiffener includes a molded portion. The molded portion is molded of an electrically nonconductive molding compound. A plurality of capacitors are embedded in the molded portion. The capacitors are constructed and arranged to be electrically connected to the package substrate. As such, power delivery performance is improved, and mechanical strength is added to the substrate.

US Patent:

6821823, Nov 23, 2004

Filed:

Dec 22, 2003

Appl. No.:

10/744316

Inventors:

Hong Xie - Phoenix AZ
Debendra Mallik - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2144

US Classification:

438127, 438112, 438124, 438125

Abstract:

A molded stiffener for a package substrate is presented. The stiffener includes a molded portion. The molded portion is molded of an electrically nonconductive molding compound. A plurality of capacitors are embedded in the molded portion. The capacitors are constructed and arranged to be electrically connected to the package substrate. As such, power delivery performance is improved, and mechanical strength is added to the substrate.