How T Lin

US Patent:

6454469, Sep 24, 2002

Filed:

Jun 29, 1999

Appl. No.:

09/343071

Inventors:

Richard R. Hall - Endwell NY
How Tzu Lin - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 626

US Classification:

385 90, 385 89, 385 52

Abstract:

An optical coupling assembly is described that optically aligns an opto-electronic device, such as a Vertical Cavity Surface Emitting Laser (VCSEL) chip, with a fiber optic coupler upon a heatsink substrate. The assembly has a number of biasing elements that acts against the coupler to provide contact with mating surfaces. Adjustment devices, such as screws, acting against the coupler and biasing elements, are adjusted until the fiber optic transmitting elements of the coupler align with the opto-electronic device light emitting elements. Photodetectors disposed upon a distal end of the coupler receive the light from the opto-electronic device, and provide a mechanism to detect optimum alignment.

US Patent:

6471419, Oct 29, 2002

Filed:

Jun 7, 1999

Appl. No.:

09/327783

Inventors:

Richard R. Hall - Endwell NY
How Tzu Lin - Vestal NY
Candido C. Tiberia - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 636

US Classification:

385 91, 385 49, 385 52, 385 15

Abstract:

A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular correction is made about the selected element by differentially moving the array in two axes, using adjustment tools. Alignment is accomplished by performing translational movement in the horizontal X and Y axes until a signal is detected. A rotational correction about the selected element is performed by moving one of a pair of adjustment devices until maximum light intensity is achieved for the end elements. Next, the array is scanned for the weakest performing element in the array. The alignment procedure is repeated until the performance of all of the elements in the array fall within a pre-established specification range.

US Patent:

6527457, Mar 4, 2003

Filed:

Feb 1, 2001

Appl. No.:

09/775725

Inventors:

Benson Chan - Vestal NY
Richard R. Hall - Endwell NY
How T. Lin - Vestal NY
John H. Sherman - Lisle NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 636

US Classification:

385 89

Abstract:

An optical fiber guide includes a matrix of holes integrated directly into a substrate on which one or more optical chips are mounted. The substrate therefore functions both as a guide for optically coupling a plurality of optical fibers to an optical chip, as well as a carrier for the optical chip itself. The size of the fiber guide and its integration density is therefore improved over conventional fiber connectors. The substrate is preferably made of a material having a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the optical chip. This ensures that the optical fibers will remain optically coupled to the chip through the matrix of holes in the substrate regardless of external temperature influences. If desired, integrated circuits may be mounted onto the substrate to increase the functionality of the fiber guide. A method for making the fiber guide has fewer process steps than conventional methods because fiber guide has fewer parts than conventional fiber-optic connectors.

US Patent:

6580491, Jun 17, 2003

Filed:

Dec 26, 2000

Appl. No.:

09/749044

Inventors:

Richard Ronald Hall - Endwell NY
Robert Lee Lewis - Apalachin NY
How Tzu Lin - Vestal NY
Peter Michael Nichols - Johnson City NY
Robert David Sebesta - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03B 2768

US Classification:

355 52, 355 53, 356399, 356401

Abstract:

Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

US Patent:

6580494, Jun 17, 2003

Filed:

Jul 16, 2002

Appl. No.:

10/198383

Inventors:

Richard Ronald Hall - Endwell NY
Robert Lee Lewis - Apalachin NY
How Tzu Lin - Vestal NY
Peter M. Nichols - Johnson City NY
Robert David Sebesta - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03B 2752

US Classification:

355 55

Abstract:

A photolithography imaging system and method that performs the tasks of mask alignment, panel recognition, establishing position offsets and adjusting mask rotation for accurate overlay imaging of the mask onto the panel, and correctly adjusting image magnification or reduction to properly size each stepped image to the panel distortion. This invention applies more directly to substrate panels whose dimensional stability is found difficult to control, repeatedly. More specifically, it applies to panels whose X axis distortion factor varies greatly from its Y axis distortion factor and the average adjustment of the image magnification or reduction does not satisfy tight registration requirements. What is new is that the calculation of the magnification or reduction adjustment is based on the mask image dimensions.

US Patent:

6635866, Oct 21, 2003

Filed:

Apr 19, 2001

Appl. No.:

09/838645

Inventors:

Benson Chan - Vestal NY
Richard R. Hall - Endwell NY
How T. Lin - Vestal NY
John H. Sherman - Lisle NY

Assignee:

Internation Business Machines Corporation - Armonk NY

International Classification:

H01J 502

US Classification:

250239

Abstract:

An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.

US Patent:

6644864, Nov 11, 2003

Filed:

Mar 14, 2002

Appl. No.:

10/097767

Inventors:

Benson Chan - Vestal NY
Richard R. Hall - Endwell NY
How T. Lin - Lisle NY
John H. Sherman - Lisle NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 638

US Classification:

385 65, 385 59

Abstract:

The present invention relates generally to fiber optical arrays, and particularly, but not by way of limitation, to 3-dimentional array fiber optical couplers. More particularly, the present invention provides means of coupling semiconductor laser light sources to fiber-optic transmission devices.

US Patent:

6651013, Nov 18, 2003

Filed:

Nov 16, 2000

Appl. No.:

09/714372

Inventors:

How T. Lin - Vestal NY
Christopher J. Majka - Owego NY
Matthew Francis Seward - Windsor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3100

US Classification:

702 59, 702 57, 702 58, 702 64, 702 65, 702 69, 702183

Abstract:

A method and apparatus for locating a short between two nets in an electrical wire network of a microelectronic structure (e. g. , chip, chip carrier, circuit card, etc. ). A first net and a second net of the electrical wire are electrically shorted at an unknown point P on the first net. Points P and P on the first net such are selected such that P is located on a path between P and P along the first net. A constant current pulse source is electrically connected between P and P and is activated. Voltage drops V (from P to P ) and V (from P to a point P on the second net) are measured. A length L of the path from P to P is calculated as a function of V /V. Computer graphics may be used to graphically display the location of the short within the microelectronic structure.