Hung K Chau

US Patent:

D466708, Dec 10, 2002

Filed:

Sep 8, 2000

Appl. No.:

29/129291

Inventors:

Hung Hong Chau - El Monte CA 91732

International Classification:

0601

US Classification:

D 6370, D6381

US Patent:

20180126698, May 10, 2018

Filed:

Jan 17, 2018

Appl. No.:

15/873087

Inventors:

- Duesseldorf, DE
Hung Chau - Fountain Valley CA, US
Tadashi Takano - Kanagawa, JP

Assignee:

Henkel IP & Holding GmbH - Duesseldorf

International Classification:

B32B 7/06
B32B 7/12
B32B 27/36
B32B 27/08
B32B 27/20
C09J 7/40
C09J 7/38
C09J 7/50

Abstract:

Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

US Patent:

20160340557, Nov 24, 2016

Filed:

Aug 5, 2016

Appl. No.:

15/229596

Inventors:

- Duesseldorf, DE
Ly Do - Cypress CA, US
Hung Chau - Fountain Valley CA, US
Younsang Kim - Foothill Ranch CA, US
Julissa Eckenrode - Tustin CA, US

International Classification:

C09J 9/00
C09J 11/04
H01L 23/373
C09J 179/08
H01L 23/29
C09K 5/14
C09J 5/00

Abstract:

Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for the preparation of a variety of electronic devices, such as flip chip packages, stacked dies, hybrid memory cubes, through-silica via (TSV) devices, and the like. In certain embodiments of the invention, there are provided assemblies comprising a first article permanently adhered to a second article by a cured aliquot of a formulation as described herein. In certain embodiments of the invention, there are provided methods for adhesively attaching a first article to a second article. In certain embodiments of the present invention, there are provided methods for improving heat dissipation by electronic devices assembled employing thermally conductive, but electrically non-conductive adhesive.