Hung Shiung Chen

US Patent:

6361420, Mar 26, 2002

Filed:

Feb 8, 2000

Appl. No.:

09/500137

Inventors:

Steven Zuniga - Soquel CA
Hung Chen - San Jose CA
Gopalakrishna B. Prabhu - San Francisco CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 722

US Classification:

451288, 451398

Abstract:

A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.

US Patent:

6368191, Apr 9, 2002

Filed:

Sep 20, 2000

Appl. No.:

09/665838

Inventors:

Steven M. Zuniga - Soquel CA
Hung Chih Chen - San Jose CA
Manoocher Birang - Los Gatos CA
Kapila Wijekoon - Santa Clara CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 100

US Classification:

451 41, 451287, 451288, 451397, 451398

Abstract:

A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

US Patent:

6386955, May 14, 2002

Filed:

Dec 5, 2000

Appl. No.:

09/730944

Inventors:

Steven M. Zuniga - Soquel CA
Manoocher Birang - Los Gatos CA
Hung Chen - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 100

US Classification:

451 56, 451398, 451287, 451 41

Abstract:

A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

US Patent:

6390908, May 21, 2002

Filed:

Jul 1, 1999

Appl. No.:

09/345429

Inventors:

Hung Chih Chen - San Jose CA
Steven M. Zuniga - Soquel CA
Bret W. Adams - Sunnyvale CA
Manoocher Birang - Los Gatos CA
Kean Chew - Santa Clara CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 500

US Classification:

451398, 451397, 451288, 451 41, 451 8

Abstract:

Apparatus and methods of polishing substrates are disclosed. A retaining ring for a polishing apparatus includes an inner surface exposed to contact a peripheral edge of a substrate to be polished against a polishing surface, a bottom surface exposed to contact the polishing surface while the substrate is being polished, and a wear marker indicative of a preselected amount of wear of the bottom surface. The inner surface, bottom surface and wear marker may form part of a retaining ring used in chemical mechanical polishing operations. In one method, one or more substrates may be polished against a polishing surface using the retaining ring, and at least a portion of the retainer may be replaced when the bottom surface has been worn away by the preselected amount indicated by the wear marker. In another method, one or more substrate may be polished against a polishing surface with a substrate carrier that includes a substrate retaining ring with a wear marker indicative of a preselected amount of wear of the retaining ring, and a warning signal may be generated upon detection of the wear marker.

US Patent:

6406361, Jun 18, 2002

Filed:

Oct 20, 2000

Appl. No.:

09/693041

Inventors:

Steven Zuniga - Soquel CA
Hung Chen - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 4702

US Classification:

451287, 451286, 451288, 451289, 451398

Abstract:

A carrier head for a chemical mechanical polishing apparatus includes a base, a flexible membrane extending beneath the base to provide a mounting surface for a substrate, and a retaining ring surrounding the mounting surface. An edge portion of the flexible membrane extends around an outer surface of a support structure. An outer surface of the support structure is tapered to reduce binding between the flexible membrane and the retaining ring. Alternately, there may be a relatively wide gap between the support structure and the retaining ring, or a sidewall portion of the flexible membrane may be reinforced.

US Patent:

6431968, Aug 13, 2002

Filed:

Apr 22, 1999

Appl. No.:

09/296937

Inventors:

Hung Chih Chen - San Jose CA
Steven M. Zuniga - Soquel CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 4702

US Classification:

451398, 451288

Abstract:

A carrier head for a chemical mechanical polishing apparatus has a base, a first flexible membrane extending beneath the base to form a first pressurizable chamber, a support structure positioned in the first chamber, and a compressible film adjacent a bottom surface of the support structure. A lower surface of the first flexible membrane providing a mounting surface for a substrate. The compressible film has a plurality of apertures disposed in a pattern to establish a pressure distribution on a top surface of the first flexible membrane.

US Patent:

6436228, Aug 20, 2002

Filed:

May 15, 1998

Appl. No.:

09/080094

Inventors:

Steven M. Zuniga - Soquel CA
Hung Chih Chen - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23F 102

US Classification:

156345, 438691

Abstract:

A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.

US Patent:

6436828, Aug 20, 2002

Filed:

May 4, 2000

Appl. No.:

09/565200

Inventors:

Hung Chih Chen - San Jose CA
Steven M. Zuniga - Soquel CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01L 21461

US Classification:

438691, 438692

Abstract:

A chemical mechanical polishing apparatus includes a carrier head, a platen positioned on an opposing side of the carrier head, and a polishing pad positioned on the platen to contact and polish the substrate received on the substrate receiving surface. The carrier head includes a housing, a flexible membrane attached to the housing and having a substrate receiving surface to receive a substrate. The flexible membrane has magnetically sensitive particles distributed therein. One or more coils are positioned above the flexible membrane to generate magnetic fields to exert magnetic forces on the particles.