Hung H Chen

age ~71

from South Setauket, NY

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Hung Chen Phones & Addresses

Method Of Non Invasive Stimulation Of Acupuncture Or Acupressure Points Utilizing At Least One Electrostatic Field
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US Patent:

20090228084, Sep 10, 2009
Filed:

Mar 10, 2008
Appl. No.:

12/045597
Inventors:

Hung Chuang Chen - Fremont CA, US
International Classification:

A61N 1/36
US Classification:

607115
Abstract:

A non invasive method of stimulating nerves and/or acupuncture/acupressure point(s) using at least one electrostatic field, whereby the said electrostatic field(s) is generated by a generator, said generator is a battery(ies) or a pair of charged plates. The generator voltage is between 1.2 and 100 volts. The electrostatic field generator(s) may be separated from an electrostatic field releasing window(s) by a filter(s), which electrostatic field window(s) is(are) placed on a skin contact pertaining to an acupuncture/acupressure point(s). The method will not release any current to the human skin. This method of stimulation is safer, more efficient and comfortable than its competitive technology, as the patients will not suffer from any discomfort caused by a current. This method of stimulation may be used in controlling certain symptoms and diseases in humans (e.g. nausea, insomnia, stress, hypertension) in accordance with Eastern medicine principles.

Anti-Slip Scrubber Brush And Assembly Methods
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US Patent:

20130283553, Oct 31, 2013
Filed:

Apr 26, 2012
Appl. No.:

13/456779
Inventors:

Hui Chen - Burlingame CA, US
Hung Chen - Sunnyvale CA, US
Assignee:

Applied Materials, Inc. - Santa Clara CA
International Classification:

A46B 15/00
A46D 3/04
A47L 13/10
US Classification:

151591, 300 21
Abstract:

In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush including exterior molded surfaces and a mounting passage having interior molded surfaces, the interior molded surfaces having molded foam, raised rotation-restraining features, and a mandrel including recesses directly coupled to the molded foam, raised rotation-restraining features of the scrubber brush to prevent slippage. Scrubber brushes and methods of assembly are provided, as are numerous other aspects.

High Stiffness, Anti-Slip Scrubber Brush Assembly, High-Stiffness Mandrel, Subassemblies, And Assembly Methods
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US Patent:

20130283556, Oct 31, 2013
Filed:

Apr 26, 2012
Appl. No.:

13/456796
Inventors:

Hui Chen - Burlingame CA, US
Hung Chen - Sunnyvale CA, US
Jim Atkinson - Los Gatos CA, US
David D. Huo - Campbell CA, US
Assignee:

APPLIED MATERIALS, INC. - Santa Clara CA
International Classification:

A46B 15/00
A46D 3/04
A46B 9/08
US Classification:

15168, 151591, 300 21
Abstract:

In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush having a body of open-cell foam including an interior surface, a sleeve received in contact with the scrubber brush, the sleeve including peripherally-spaced, longitudinal walls and reinforcing segments interconnecting adjacent ones of the longitudinal walls and forming elongated pockets along the length, the sleeve having raised ribs extending along the length, and a mandrel having recesses formed on an outer surface, the mandrel being coupled to the sleeve by receiving the raised ribs within the recesses. Scrubber brush subassemblies, high stiffness mandrels, and methods of assembly are provided, as are numerous other aspects.

Methods And Apparatus For Pre-Chemical Mechanical Planarization Buffing Module
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US Patent:

20130288578, Oct 31, 2013
Filed:

Apr 28, 2012
Appl. No.:

13/459177
Inventors:

Hui Chen - Burlingame CA, US
Allen L. D'Ambra - Burlingame CA, US
Jim K. Atkinson - Los Gatos CA, US
Hung Chen - Sunnyvale CA, US
Assignee:

APPLIED MATERIALS, INC. - Santa Clara CA
International Classification:

B24B 37/07
B24B 1/00
US Classification:

451 59, 451159
Abstract:

The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.

Vapor Dryer Module With Reduced Particle Generation
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US Patent:

20150050105, Feb 19, 2015
Filed:

Jul 25, 2012
Appl. No.:

13/882135
Inventors:

Dan Zhang - Fremont CA, US
Hui Chen - Burlingame CA, US
Jim K. Atkinson - Los Gatos CA, US
Hung Chih Chen - Sunnyvale CA, US
Allen L. D'Ambra - Burlingame CA, US
Assignee:

APPLIED MATERIALS, INC. - Santa Clara CA
International Classification:

H01L 21/67
H01L 21/677
B25J 11/00
H01L 21/673
F26B 25/00
F26B 25/14
US Classification:

41422207
Abstract:

Embodiments described herein generally relate to a vapor dryer module for cleaning substrates during a chemical mechanical polishing (CMP) process. In one embodiment, a module for processing a substrate is provided. The module includes a tank having sidewalls with an outer surface and an inner surface defining a processing volume, a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume, and one or more actuators disposed on an outer surface of one of the sidewalls of the tank and coupled between the outer surface and the second portion of the support structure, the one or more actuators operable to move the support structure relative to the tank.

Methods And Apparatus For Conditioning Of Chemical Mechanical Polishing Pads
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US Patent:

20140206263, Jul 24, 2014
Filed:

Mar 13, 2013
Appl. No.:

13/801127
Inventors:

Rajeev BAJAJ - Fremont CA, US
Hung Chih CHEN - Sunnyvale CA, US
International Classification:

B24B 53/017
B24B 53/00
B24B 37/34
US Classification:

451 56, 451443, 451 72
Abstract:

A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad.