Hung Quan Hoang

US Patent:

20050020077, Jan 27, 2005

Filed:

Apr 16, 2004

Appl. No.:

10/826487

Inventors:

Bo Zheng - Saratoga CA, US
Hung Hoang - San Jose CA, US
Methelyn Murphy - San Jose CA, US

International Classification:

B05D003/12
H01L021/302
H01L021/461

US Classification:

438689000

Abstract:

Embodiments of the invention generally provide a method for cleaning the bevel edge of a semiconductor substrate, while simultaneously providing protection layer over the production surface of the substrate. The protection layer operates to shield the production surface from contact with any cleaning fluid that is applied to the bevel edge of the substrate. The protection layer may include a thin layer of deionized water applied to the center of the substrate while the substrate is rotated. The method for forming the protection layer generally includes rotating the semiconductor substrate on a substrate support member, dispensing an etching solution onto the bevel of the substrate with a first pivotally mounted fluid dispensing nozzle, and dispensing a protective fluid onto a central portion of the substrate simultaneously with the dispensing of the etching solution with a second pivotally mounted fluid dispensing nozzle.

US Patent:

20070232072, Oct 4, 2007

Filed:

Dec 6, 2006

Appl. No.:

11/567595

Inventors:

Bo Zheng - Saratoga CA, US
Hung Hoang - San Jose CA, US
Methelyn Murphy - Austin TX, US

International Classification:

H01L 21/302

US Classification:

438695000, 257E21214, 257E21219

Abstract:

Embodiments of the invention generally provide an apparatus and a method for cleaning the bevel edge of a semiconductor substrate, while simultaneously providing a protection layer over the production surface of the substrate. The method for forming the protection layer generally includes rotating the semiconductor substrate on a substrate support member, dispensing an etching solution onto the bevel of the substrate with a first pivotally mounted fluid dispensing nozzle, and dispensing a protective fluid onto a central portion of the substrate simultaneously with the dispensing of the etching solution with a second pivotally mounted fluid dispensing nozzle.

US Patent:

20210405665, Dec 30, 2021

Filed:

Jun 23, 2021

Appl. No.:

17/356287

Inventors:

- Santa Clara CA, US
Hung Xuan Hoang - Milpitas CA, US
Dmitry Sklyar - San Jose CA, US
Farooq Aleem - Cupertino CA, US
Jagan Rangarajan - Fremont CA, US
William Wadsworth - Santa Clara CA, US
Brett Hoogensen - Los Gatos CA, US

International Classification:

G05D 7/06
G05B 19/042

Abstract:

In a substrate processing system, such as a chemical mechanical system, updated controller configuration data is obtained for a plurality of liquid flow controllers of the substrate processing system. Each of a plurality of liquid flow controllers (LFCs) coupled to an Ethernet for Control Automation Technology (EtherCAT) bus automatically downloads a copy of the updated controller configuration data through the EtherCAT bus. Each of the plurality of liquid flow controllers controls fluid flow of a separate fluid line from a plurality of fluid lines in the substrate processing system, fluid flow through the plurality of fluid lines is controlled using the plurality of liquid flow controllers having the updated controller configuration data.