Jack M Mccreary

US Patent:

53783077, Jan 3, 1995

Filed:

Apr 28, 1993

Appl. No.:

8/054108

Inventors:

Steven L. Bard - Endwell NY
Gerald A. Bendz - Vestal NY
Michael J. Canestaro - Endicott NY
John R. Chapura - Endicott NY
Edward J. Frankoski - Newark Valley NY
Michael S. Horan - Maine NY
Jeffrey D. Jones - Newark Valley NY
James S. Kamperman - Endicott NY
John R. Kjelgaard - Whitney Point NY
Jack M. McCreary - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B08B 302

US Classification:

156639

Abstract:

A fluid treatment apparatus and method for applying first and second fluids (e. g. , etchant and water) to an article (e. g. , circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e. g. , a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid.

US Patent:

54149282, May 16, 1995

Filed:

Apr 2, 1993

Appl. No.:

8/042196

Inventors:

Barry A. Bonitz - Endicott NY
James V. Ellerson - Endicott NY
Kishen N. Kapur - Vestal NY
Jack M. McCreary - Apalachin NY
Irving Memis - Vestal NY
Gerald M. Vettel - Pine Island MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 334

US Classification:

29840

Abstract:

An electronic package assembly wherein a low profile package is soldered to an organic (e. g. , epoxy resin) substrate (e. g. , printed circuit board), the projecting conductive leads of the package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (e. g. , polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

US Patent:

52926885, Mar 8, 1994

Filed:

Jun 1, 1992

Appl. No.:

7/890798

Inventors:

Richard Hsiao - Vestal NY
Jack M. McCreary - Apalachin NY
Voya R. Markovich - Endwell NY
Donald P. Seraphim - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2120

US Classification:

437209

Abstract:

Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.

US Patent:

51211904, Jun 9, 1992

Filed:

Mar 14, 1990

Appl. No.:

7/493125

Inventors:

Richard Hsiao - Vestal NY
Jack M. McCreary - Apalachin NY
Voya R. Markovich - Endwell NY
Donald P. Seraphim - Vestal NY

Assignee:

International Business Machines Corp. - Armonk NY

International Classification:

H01L 2314
H01L 2354
H01L 2340

US Classification:

357 80

Abstract:

Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.